Mechanically flexible chip-to-substrate optical interconnections using optical pillars

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 1, 2008, Pages 143-153

  Bakir, Muhannad S ^a   Glebov, Alexei L ^b   Lee, Michael G ^b   Kohl, Paul A ^a   Meindl, James D ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b FUJITSU LABORATORIES OF AMERICA   (United States)

Author keywords

Assembly; Compliant interconnects; Flip chip; Input output (I O); Integration; Optical interconnects; Packaging; Polymers; Waveguides

Indexed keywords

FLIP CHIP DEVICES; LIGHT SOURCES; OPTICAL INTERCONNECTS; PHOTODETECTORS; THERMAL EXPANSION;

COMPLIANT INTERCONNECTS; OPTICAL COUPLING EFFICIENCY;

OPTICAL WAVEGUIDES;

EID: 40549135009     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.914976     Document Type: Article

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