SMT-Compatible Large-Tolerance "OptoBump" Interface for Interchip Optical Interconnections

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 2, 2003, Pages 122-127

  Ishii, Yuzo ^a   Koike, Shinji ^a   Arai, Yoshimitsu ^a   Ando, Yasuhiro ^a,b  

^a NTT CORPORATION   (Japan)

^b FUJIKURA LTD   (Japan)

Author keywords

Microlens; Optical interconnects; Packaging; Polymer waveguide; Surface mount technology; Vertical cavity surface emitting laser

Indexed keywords

ELECTRONICS PACKAGING; MICROLENSES; OPTICAL FIBERS; OPTOELECTRONIC DEVICES; PRINTED CIRCUIT BOARDS; SURFACE MOUNT TECHNOLOGY;

SURFACE EMITTING LASERS;

OPTICAL INTERCONNECTS;

EID: 0141951976     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.817332     Document Type: Article

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