메뉴 건너뛰기




Volumn 9, Issue 2, 2003, Pages 518-530

Low-cost microoptical modules for MCM level optical interconnections

Author keywords

Deep proton lithography; Microoptics; OE VLSI; Optical interconnections; VCSELS

Indexed keywords

BIT ERROR RATE; CMOS INTEGRATED CIRCUITS; MATHEMATICAL MODELS; MULTICHIP MODULES; OPTICAL DESIGN; OPTICAL SYSTEMS; PHOTOLITHOGRAPHY; PLASTICS APPLICATIONS; PRISMS; REFRACTION;

EID: 10744230916     PISSN: 1077260X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSTQE.2003.813316     Document Type: Article
Times cited : (60)

References (30)
  • 1
    • 0022942016 scopus 로고
    • Semiconductor optical bistability: Toward the optical computer
    • Berlin, Germany: Springer-Verlag
    • B. S. Wherret, "Semiconductor optical bistability: Toward the optical computer," in Springer Proceedings in Physics 7. Berlin, Germany: Springer-Verlag, 1985, pp. 180-221.
    • (1985) Springer Proceedings in Physics 7 , pp. 180-221
    • Wherret, B.S.1
  • 3
    • 0000894702 scopus 로고    scopus 로고
    • Rationale and challenges for optical interconnects to electronic chips
    • June
    • D. A. B. Miller, "Rationale and challenges for optical interconnects to electronic chips," Proc. IEEE, vol. 88, pp. 728-749, June 2000.
    • (2000) Proc. IEEE , vol.88 , pp. 728-749
    • Miller, D.A.B.1
  • 4
    • 84975659844 scopus 로고
    • Comparison between optical and electrical interconnections based on power and speed considerations
    • M. R. Feldman, S. C. Esener, C. C. Guest, and S. H. Lee, "Comparison between optical and electrical interconnections based on power and speed considerations," Appl. Opt., vol. 27, pp. 1742-1751, 1988.
    • (1988) Appl. Opt. , vol.27 , pp. 1742-1751
    • Feldman, M.R.1    Esener, S.C.2    Guest, C.C.3    Lee, S.H.4
  • 5
    • 0031701866 scopus 로고    scopus 로고
    • Speed and energy analysis of digital interconnections: Comparison of on-chip, off-chip, and free-space technologies
    • G. I. Yayla, P. J. Marchand, and S. C. Esener, "Speed and energy analysis of digital interconnections: Comparison of on-chip, off-chip, and free-space technologies," Appl. Opt., vol. 37, no. 2, pp. 205-227, 1998.
    • (1998) Appl. Opt. , vol.37 , Issue.2 , pp. 205-227
    • Yayla, G.I.1    Marchand, P.J.2    Esener, S.C.3
  • 6
    • 0030114091 scopus 로고    scopus 로고
    • Scaling opto-electronic-VLSI circuits into the 21st century: A technology roadmap
    • Apr.
    • A. Krishnamoorthy and D. Miller, "Scaling opto-electronic-VLSI circuits into the 21st century: A technology roadmap," IEEE J. Select. Topics Quantum Electron., vol. 2, pp. 55-76, Apr. 1996.
    • (1996) IEEE J. Select. Topics Quantum Electron. , vol.2 , pp. 55-76
    • Krishnamoorthy, A.1    Miller, D.2
  • 13
    • 0032073340 scopus 로고    scopus 로고
    • Plastic modules for free-space optical interconnects
    • D. T. Neilson and E. Schenfeld, "Plastic modules for free-space optical interconnects," Appl. Opt., vol. 37, no. 14, pp. 2944-2952, 1998.
    • (1998) Appl. Opt. , vol.37 , Issue.14 , pp. 2944-2952
    • Neilson, D.T.1    Schenfeld, E.2
  • 14
    • 0034207434 scopus 로고    scopus 로고
    • Crosstalk and interconnection distance considerations for board-to-board optical interconnects using 2-D VCSEL and microlens array
    • June
    • G. Kim, X. Han, and R. T. Chen, "Crosstalk and interconnection distance considerations for board-to-board optical interconnects using 2-D VCSEL and microlens array," IEEE Photon. Technol. Lett., vol. 12, pp. 743-745, June 2000.
    • (2000) IEEE Photon. Technol. Lett. , vol.12 , pp. 743-745
    • Kim, G.1    Han, X.2    Chen, R.T.3
  • 15
    • 0000461108 scopus 로고    scopus 로고
    • Integrated micro-optical imaging-system with a high interconnection capacity fabricated in planar optics
    • S. Sinzinger and J. Jahns, "Integrated micro-optical imaging-system with a high interconnection capacity fabricated in planar optics," Appl. Opt., vol. 36, pp. 4729-4735, 1997.
    • (1997) Appl. Opt. , vol.36 , pp. 4729-4735
    • Sinzinger, S.1    Jahns, J.2
  • 17
    • 0242434757 scopus 로고    scopus 로고
    • International Technology Roadmap for Semiconductors [Online]
    • International Technology Roadmap for Semiconductors [Online]. Available: http://public.itrs.net/Files/2001ITRS/Home.htm
  • 18
    • 84938451651 scopus 로고
    • Laser beams and resonators
    • H. Kogelnik and T. Li, "Laser beams and resonators," Proc. IEEE, vol. 54, pp. 1312-1329, 1966.
    • (1966) Proc. IEEE , vol.54 , pp. 1312-1329
    • Kogelnik, H.1    Li, T.2
  • 19
    • 0242518299 scopus 로고
    • Complex paraxial wave optics
    • Mill Valley, CA: Univ. Sci. Books; ch. 20
    • E. Siegman, "Complex paraxial wave optics," in Lasers. Mill Valley, CA: Univ. Sci. Books, 1986, ch. 20.
    • (1986) Lasers
    • Siegman, E.1
  • 20
    • 0242434760 scopus 로고    scopus 로고
    • Optically Interconnected Integrated Circuits, Rationale and Project Summary [Online]
    • Optically Interconnected Integrated Circuits, Rationale and Project Summary [Online]. Available: http://www.intec.rug.ac.be/oiic/ratio-nale.html
  • 23
    • 0000654715 scopus 로고    scopus 로고
    • Deep lithography with protons: A generic fabrication technology for refractive micro-optical components and modules
    • Apr.
    • B. Volckaerts, H. Ottevaere, P. Vynck, C. Debaes, P. Tuteleers, A. Hermanne, I. Veretennicoff, and H. Thienpont, "Deep lithography with protons: A generic fabrication technology for refractive micro-optical components and modules," Asian J. Phys., vol. 10, no. 2, pp. 195-214, Apr. 2001.
    • (2001) Asian J. Phys. , vol.10 , Issue.2 , pp. 195-214
    • Volckaerts, B.1    Ottevaere, H.2    Vynck, P.3    Debaes, C.4    Tuteleers, P.5    Hermanne, A.6    Veretennicoff, I.7    Thienpont, H.8
  • 25
    • 0022717983 scopus 로고
    • Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming and plastic moulding (LIGA process)
    • E. W. Becker, W. Ehrfeld, R. Hagmann, A. Maner, and D. Münchmeyer, "Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming and plastic moulding (LIGA process)," Micro-Electron. Eng., vol. 4, pp. 35-56, 1986.
    • (1986) Micro-Electron. Eng. , vol.4 , pp. 35-56
    • Becker, E.W.1    Ehrfeld, W.2    Hagmann, R.3    Maner, A.4    Münchmeyer, D.5
  • 28
    • 0242602988 scopus 로고    scopus 로고
    • Device fabrication and packaging
    • New York: Wiley; ch. 6
    • M. Fukuda, "Device fabrication and packaging," in Optical Semiconductor Devices. New York: Wiley, 1998, ch. 6.
    • (1998) Optical Semiconductor Devices
    • Fukuda, M.1
  • 30
    • 0035761771 scopus 로고    scopus 로고
    • Sense and nonsense of logic-level optical interconnect: Reflections on an experiment
    • July
    • J. Van Campenhout, M. Brunfaut, W. Meeus, J. Dambre, and M. De Wilde, "Sense and nonsense of logic-level optical interconnect: Reflections on an experiment," in Proc. SPIE, vol. 4455, July 2001, pp. 151-159.
    • (2001) Proc. SPIE , vol.4455 , pp. 151-159
    • Van Campenhout, J.1    Brunfaut, M.2    Meeus, W.3    Dambre, J.4    De Wilde, M.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.