Anisotropic thermal expansion behavior of thin films of polymethylsilsesquioxane, a spin-on-glass dielectric for high-performance integrated circuits

Langmuir

Volumn 20, Issue 16, 2004, Pages 6932-6939

  Oh, Weontae ^a   Ree, Moonhor ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CALCINATION; DIELECTRIC MATERIALS; INTEGRATED CIRCUITS; ORGANIC POLYMERS; PLASTIC FILMS; SEMICONDUCTOR DEVICES; THERMAL EXPANSION;

ELECTRICAL PERFORMANCE; INTERDIELECTRIC LAYERS; MECHANICAL STRESSES; RESIDUAL STRESS ANALYSIS;

THIN FILMS;

ANISOTROPY; DIELECTRIC PROPERTIES; ELECTRIC CIRCUITS; PLASTIC FILMS; POLYMERS; THERMAL EXPANSION; THIN FILMS;

EID: 4043102553     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la049581m     Document Type: Article

References (62)

1. (a) Tummala, R. R., Rymaszewski, E. J., Eds. Microelectronics Packaging Handbook; van Nostrand Reinhold: New York, 1989.
2. (b) Czornyj, G.; Chen, K. J.; Prada-Silva, G.; Arnold, A.; Souleotis, H.; Kim, S.; Ree, M.; Volksen, W.; Dawson, D.; DiPietro, R. Proc. Electron. Compon, Technol. Conf. (IEEE) 1992, 42, 682.
3. Feng, Z.-C.; Liu, H.-D. J. Appl. Phys. 1983, 54, 83.
4. (a) Singer, P. Semicond. Int. 1997, 21, 73.
5. (b) The National Technology Roadmap for Semiconductors: Technology Needs; Semiconductor Industry Association: San Jose, CA, 1997; p 101.
6. (c) Havemann, R. Proc. Ultra Low k Workshop (ACS Div. Polym. Chem.) 1999, 1-17.
7. (d) Carter, K. R. Proc. Ultra Low k Workshop (ACS Div. Polym. Chem.) 1999, 60-80.
8. (e) Liu, R.; Pai, C.-S.; Martinez, E. Solid-State Electron. 1999, 43, 1003.
9. (f) Chiang, S.-K.; Lassen, C. L. Solid State Technol. 1999, 10, 42.
10. (g) Carter, K. R.; Dawson, D. J.; DiPietro, R. A.; Hawker, J.; Hedrick, J. L.; Miller, R. D.; Yoon, D. Y. U.S. Patent No. 5,895,263, April 20, 1999.
11. (h) Romo-Uribe, A.; Mather, P. T.; Haddad, T. S.; Lichtenhan, J. D. J. Polym. Sci., Part B: Polym. Phys. 1998, 36, 1857.
12. (a) Ree, M.; Goh, W. H.; Kim, Y. Polym. Bull. 1995, 35, 215.
13. (b) Hedrick, J. L.; Miller, R. D.; Hawker, C. J.; Carter, K. R.; Volksen, W.; Yoon, D. Y.; Trollsas, M. Adv. Mater. 1998, 10, 1049.
14. (c) Ying, J. Y.; Mehnert, C. P.; Wong, M. S. Angew. Chem., Intl. Ed. 1999, 38, 56.
15. (d) Nguyen, C. V.; Carter, K. R.; Hawker, C. J.; Hedrick, J. L.; Jaffe, R. L.; Miller, R. D.; Remenar, J. F.; Rhee, H.-W.; Rice, P. M.; Toney, M. F.; Trollsas, M.; Yoon, D. Y. Chem. Mater. 1999, 11, 3080.
16. (e) Cook, R. F.; Liniger, E. G. J. Electrochem. Soc. 1999, 146, 4439.
17. (f) Nguyen, C. V.; Hawker, C. J.; Miller, R. D.; Huang, E., Hedrick, J. L.; Gauderon, R.; Hilborn, J. G. Macromolecules 2000, 33, 4281.
18. (g) Oh, W.; Hwang, Y.-T.; Park, Y. H.; Ree, M.; Chu, S.-H.; Char, K.; Lee, J. K.; Kim, S. Y. Polymer 2003, 44, 2519.
19. Bolze, J.; Ree, M.; Youn, H. S.; Chu, S. H.; Char, K. Langmuir 2001, 17, 6683.
20. Yang, S.; Mirau, P. A.; Pai, C.-S.; Nalamasu, O.; Reichmanis, E.; Lin, E. K.; Lee, H.-J.; Gidley, D. W. Chem. Mater. 2001, 13, 2762.
21. Yang, S.; Mirau, P. A.; Pai, C.-S.; Nalamasu, O.; Reichmanis, E.; Pai, J. C.; Obeng, Y. S.; Seputro, J.; Lin, E. K.; Lee, H.-J.; Sun, J.; Gidley, D. W. Chem. Mater. 2002, 14, 369.
22. (a) Morgen, M.; Ryan, E. T.; Zhao, J.-H.; Hu, C.; Cho, T.; Ho, P. S. Annu. Rev. Mater. Sci. 2000, 30, 645.
23. (b) Maier, G. Prog. Polym. Sci. 2001, 26, 3.
24. (a) Oh, W.; Shin, T. J.; Ree, M.; Jin, M. Y.; Char, K. Macromol. Chem. Phys. 2002,203,791.
25. (b) Oh, W.; Shin, T. J.; Ree, M.; Jin, M. Y.; Char, K. Mol. Cryst. Liquid Cryst. 2001, 371, 897.
26. (a) Lee, K.-W.; Viehbeok, A.; Walker, G. F.; Cohen, S.; Zucco, P.; Chen, R.; Ree, M. J. Adhes. Sci. Technol. 1996, 10, 807.
27. (b) Yu, J.; Ree, M.; Shin, T. J.; Wang, X.; Cai, W.; Zhou, D.; Lee, K.-W. J. Polym. Sci., Polym. Phys. Ed. 1999, 37, 2806.
28. (c) Yu, J.; Ree, M.; Park, Y. H.; Shin, T. J.; Cai, W.; Zhou, D.; Lee, K.-W. Macromol. Chem. Phys. 2000, 201, 491.
29. (a) Ree, M.; Shin, T. J.; Park, Y.-H.; Kim, S. I.; Woo, S. H.; Cho, C. K.; Park, C. E. J. Polym. Sci., Part B: Polym. Phys. 1998, 36, 1261.
30. (b) Ree, M.; Park, Y.-H.; Kim, K.; Cho, C. K.; Park, C. E. Polymer 1997, 38, 6333.
31. (c) Elsner, G.; J. Appl. Polym. Sci. 1987, 34, 815.
32. (d) Goldsmith, C.; Geldermans, P.; Bedetti, F.; Walker, G. A. J. Vac. Sci. Technol. 1983, A1 (2), 407.
33. (e) Ree, M.; Kim, K.; Woo, S. H.; Chang, H. J. Appl. Phys. 1997, 81, 698.
34. (f) Ree, M.; Nunes, T. L.; Czornyj, G.; Volksen, W. Polymer 1992, 33, 1228.
35. (g) Ree, M.; Chu, C. W.; Goldberg, M. J. J. Appl. Phys. 1994, 75, 1410.
36. (h) Huffman, W. R. Physics of Thin Film; Hass, G., Thun, R. E., Eds.; Academic; New York, 1966; Vol. 3, p 211.
37. (a) Jou, J.-H.; Huang, P.-T. Macromolecules 1991, 24, 3796.
38. (b) Jou, J.-H.; Huang, P.-T.; Chen, H.-C.; Liao, C.-N. Polymer 1882, 33, 967.
39. (a) Guide to using WVASE32: Ellipsometry manual of J.A. Woollam Co.: Lincoln, NE, 2003.
40. (b) Paik, W.-K. Modern Aspects of Electrochemistry, No, 25; Bockris, John O'M., et al., Eds.; Plenum Press: New York, 1993, p 191.
41. (e) Tompkins, H. G.; McGahan, W. A. Spectroscopic Ellipsometry and Reflectometry, Wiley: New York, 1999.
42. (a) Bolze, J.; Kim, J.; Huang, J.-Y.; Rah, S.; Youn, H. S.; Lee, B.; Shin, T. J.; Ree, M. Macromol. Res. 2002, 10, 2.
43. (b) Park, B.-J.; Rah, S.-Y.i Park, Y.-J.; Lee, K.-B. Rev. Sci. Instrum. 1995, 66, 1722.
44. (a) Tolan, M. X-ray scattering from soft-matter thin films; Springer-Verlag: Berlin, 1999.
45. (b) Russell, T. P. Mater. Sci. Rep. 1990, 8, 171.
46. (c) Russell, T. P. Physica B 1998, 221, 267.
47. Thermal Expansion, Nonmetallic Solids; Touloukian, Y. S., Ed.; IFI/Plenum: New York, 1977; Vol. 13.
48. (a) Thomas, M. E. Handbook of optical constants of solids II; Palik, E. D., Ed.; Academic: New York, 1991; p 177.
49. (b) Akhmanov, S. A.; Nikitin, S. Y. Physical Optics; Clarendon: Oxford, 1997; p 362.
50. Kahle, O.; Wielsch, U.; Metzner, H.; Bauer, J.; Uhlig, C.; Zawatzki, C. Thin Solid Films 1998, 313-314, 803.
51. Parratt, L. G. Phys. Rev. 1954, 95, 359.
52. Névot, L.; Groce, P. Rev. Phys. Appl. 1980, 15, 761.
53. Wu, W.-L.; Liou, H.-C. Thin Solid Films 1998, 312, 73.
54. Zhao, J.-H.; Ryan, T.; Ho, P. S.; McKerrow, A. J.; Shih, W.-Y. J. Appl. Phys. 1999, 85, 6421.
55. Maden, M.; Farris, H. J. In Advances in Polyimide Science and Technology; Feger, C., Khojasteh, M., Htoo, M., Eds.; Technomic: Lancaster, PA, 1993; p 644.
56. (a) Polymer Handbook, 2nd ed.; Brandrup, J., Immergut, E. H., Eds.; Wiley: New York, 1975; Chapter V.
57. (b) Sylvester, M. F.; Olenick, J. A. Proc. Int. Electron. Packag. Conf. 1991, 833.
58. Kim, M. T. Thin Solid Films 1998, 283, 12.
59. Ryan, E. T.; Fox, R. J. I. Future Fab Int. 2000, 8, 169.
60. (a) Brinker, C. J.; Scherer, C. W. Sol-Gel Science; Academic: San Diego, CA, 1990.
61. (b) Baney, R. H.; Itoh, M.; Sakakibara, A.; Suzuki, T. Chem. Rev. 1995, 95, 1409.
62. (c) Eisenberg, P.; Erra-Balsells, R.; Ishikawa, Y.; Lucas, J. C.; Mauri, A. N.; Nonami, H.; Riccardi, C. C.; Williams, R. J. Macromolecules 2000, 33, 1940.