Effect of film formation process on residual stress of poly(p-phenylene biphenyltetracarboximide) in thin films

Polymer

Volumn 38, Issue 26, 1997, Pages 6333-6345

  Ree, M ^a   Park, Y H ^a   Kim, K ^a   Kim, S I ^a   Cho, C K ^a   Park, C E ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

Imidization; Poly(amic acid) precursor; Polyimide

Indexed keywords

AMINES; AROMATIC COMPOUNDS; HEATING; INTERFACES (MATERIALS); MOLECULAR ORIENTATION; PLASTIC FILMS; RESIDUAL STRESSES; SOLVENTS; SUBSTRATES; SYNTHESIS (CHEMICAL); THERMAL EFFECTS; X RAY DIFFRACTION ANALYSIS;

IMIDIZATION; POLYAMIC ACID; PRISM COUPLING;

POLYIMIDES;

EID: 0031341387     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0032-3861(97)00193-6     Document Type: Article

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