New frontiers in spin-on dielectrics: New techniques are enabling non-etch-back processing of spin-on films, but the future is up for grabs as the industry moves to low-k materials and damascene interconnect strategies

Semiconductor International

Volumn 20, Issue 5, 1997, Pages 73-76

  Singer, Peter ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 5844401184     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. T. Nakano, et al., "Relationship Between Chemical Composition and Film Properties of Organic Spin-on Glass," Journal of the Electrochemical Society, March 1995, p. 918.
2. P. Singer, "Low-k Dielectrics: The Search Continues," Semiconductor International, May 1996, p. 88.
3. H. Yagi, "Multilevel Interconnection Technology in System LSI," Proceedings from Semicon/Japan Technical Symposium, 1996, p. 4-3.
4. L. Forester, et al., "Development of a Three Layer Metal Backend Process for Application to a Submicron CMOS Process," VMIC, 1990.
5. C.K. Wang, et al., "A Study of Plasma Treatments on Siloxane SOG," 1994 VMIC Conf., p. 101.