Thermal-ADI - A Linear-Time Chip-Level Dynamic Thermal-Simulation Algorithm Based on Alternating-Direction-Implicit (ADI) Method

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Volumn 11, Issue 4, 2003, Pages 691-700

  Wang, Ting Yuan ^a   Chen, Charlie Chung Ping ^b  

^a University of Wisconsin Madison   (United States)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Alternating Direction Implicit (ADI); Design automation; Finite difference methods; Temperature; Thermal simulation

Indexed keywords

ALGORITHMS; BOUNDARY CONDITIONS; COMPUTER SIMULATION; FINITE DIFFERENCE METHOD; TEMPERATURE MEASUREMENT;

THERMAL SIMULATION;

VLSI CIRCUITS;

EID: 0141527489     PISSN: 10638210     EISSN: None     Source Type: Journal    
DOI: 10.1109/TVLSI.2003.812372     Document Type: Article

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