Electromigration reliability of advanced interconnects

AIP Conference Proceedings

Volumn 945, Issue , 2007, Pages 27-41

  Hu, C K ^a   Gignac, L M ^a   Baker O'Neal, B ^a   Liniger, E ^a   Yu, R ^a   Flaitz, P ^b   Stamper, A K ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

Author keywords

Cu alloy; Electromigration; Microstructure

Indexed keywords

EID: 36849021710     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2815782     Document Type: Conference Paper

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