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Volumn 511, Issue , 1998, Pages 305-316
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Reliability and copper interconnections with low dielectric constant materials
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Author keywords
[No Author keywords available]
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Indexed keywords
ACTIVATION ENERGY;
ANODES;
CATHODES;
COPPER;
DIELECTRIC MATERIALS;
ELECTROMIGRATION;
INTEGRATED CIRCUIT MANUFACTURE;
PERMITTIVITY;
POLYIMIDES;
SILICA;
THERMAL CONDUCTIVITY;
ULSI CIRCUITS;
COPPER DAMASCENE;
LOW DIELECTRIC CONSTANT;
ON CHIP INTERCONNECTIONS;
MICROELECTRONIC PROCESSING;
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EID: 0032305399
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-511-305 Document Type: Conference Paper |
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Times cited : (15)
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References (32)
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