Electromigration behavior of eutectic SnPb solder

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 41, Issue 12, 2002, Pages 7487-7490

  Choi, Jae Young ^a   Lee, Sang Su ^a   Joo, Young Chang ^a  

^a Seoul National University   (South Korea)

Author keywords

Electromigration; SnPb solder

Indexed keywords

ACTIVATION ENERGY; CURRENT DENSITY; ELECTROMIGRATION; EUTECTICS; MICROSTRUCTURE; SOLDERING ALLOYS;

RESISTANCE MEASUREMENTS;

TIN COMPOUNDS;

EID: 0036994861     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.41.7487     Document Type: Article

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