A study of electromigration in 3-D flip chip solder joint using numerical simulation of heat flux and current density

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 3, 2004, Pages 472-479

  Lee, Tien Yu Tom ^a   Lee, Taek Yeong ^b   Tu, King Ning ^c  

^a MOTOROLA INC   (United States)

^b Hanbat National University   (South Korea)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; CURRENT DENSITY; ELECTRIC CURRENT DISTRIBUTION; ELECTROMIGRATION; HEAT FLUX; MATHEMATICAL MODELS; SOLDERED JOINTS; THERMAL CONDUCTIVITY; THREE DIMENSIONAL;

CURRENT DENSITY DISTRIBUTION; HEAT CONDUCTION ANALYSIS; THREE DIMESIONAL HEAT CONDUCTION MODEL; UNDER BUMP METALLURGY;

FLIP CHIP DEVICES;

EID: 4444320035     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.831774     Document Type: Article

References (9)

1. SIA, International Technology Roadmap for Semiconductors. San Jose, CA: Semiconductor Industry Association, 1999.
2. S. Brandenburg and S. Yeh, "Electromigration studies of flip chip bump solder joints," in Proc. Surface Mount Int. Conf. Expo., 1998, pp. 337-344.
3. C. Y. Liu, C. Chen, C. N. Liao, and K. N. Tu, "Microstructure-electromigration correlation in a thin stripe of eutectic SnPb Solder stressed between Cu electrodes," Appl. Phys. Lett., vol. 75, no. 1, pp. 58450, 1999.
4. T. Y. Lee, K. N. Tu, S. M. Kuo, and D. R. Frear, "Electromigration of eutectic SnPb solder interconnects for flip chip technology," J. Appl. Phys., vol. 89, no. 6, pp. 3189-3194, Mar. 2001.
5. T. Y. Lee, K. N. Tu, and D. R. Frear, "Electromigration of eutectic SnPb and SnAg/sub 3.8/Cu/sub 0.7/flip chip solder bumps and under-bump metallization," J. Appl. Phys., vol. 90, pp. 45024508, Nov. 2001.
6. H. Gan and K. N. Tu, "Effect of electromigration on intermetallic compound formation in Pb-free solder-Cu interfaces," in Proc. 52nd Electron. Comp. Technol. Conf., 2002, pp. 1206-1212.
7. E. C. C. Yeh, W. J. Choi, K. N. Tu, P. Elenius, and H. Balkan, "Current-crowding-induced electromigration failure in flip chip solder joints," Appl. Phys. Lett., vol. 80, no. 4, pp. 580-582, Jan. 2002.
8. H. B. Huntington and A. R. Grone, J. Phys. Chem. Solids, vol. 20, no. 76, 1961.
9. Flotherm, Flomerics, Ltd., Surrey, U.K., 1999.