Cyclic chemical-vapor-deposited TiO2/Al2O3 film using trimethyl aluminum, tetrakis(diethylamino)titanium, and O 2

Journal of the Electrochemical Society

Volumn 154, Issue 8, 2007, Pages

  Song, Xuemei ^a   Takoudis, Christos G ^a,b,c  

^a University of Illinois at Chicago   (United States)

^b University of Illinois at Chicago   (United States)

^c ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS STRUCTURES; FILM ROUGHNESS; SPUTTERED FILMS;

ANNEALING; ATOMIC FORCE MICROSCOPY; CHEMICAL VAPOR DEPOSITION; FILM GROWTH; GATE DIELECTRICS; LAMINATED COMPOSITES; RUTHERFORD BACKSCATTERING SPECTROSCOPY; THERMODYNAMIC STABILITY; TITANIUM DIOXIDE; X RAY PHOTOELECTRON SPECTROSCOPY;

THIN FILMS;

EID: 34347360826     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2744136     Document Type: Article

References (29)

1. G. D. Wilk, R. M. Wallace, and J. M. Anthony, J. Appl. Phys., 89, 5243 (2001).
2. C. C. Fulton, G. Lucovsky, and R. J. Nemanich, J. Vac. Sci. Technol. B, 20, 1726 (2002).
3. K. Kukli, J. Ihanus, M. Ritala, and M. Leskela, Appl. Phys. Lett., 68, 3737 (1996).
4. A. Erbil, W. Braun, B. S. Kwak, B. J. Wilkens, L. A. Boatner, and J. D. Budai, J. Cryst. Growth, 124, 684 (1992).
5. C. J. Taylor, D. C. Gilmer, D. G. Colombo, G. D. Wilk, S. A. Campbell, J. Roberts, and W. L. Gladfelter, J. Am. Chem. Soc., 121, 5220 (1999).
6. A. S. R. B. Clark-Phelps, L. Cleveland, T. E. Seidel, and O. Sneh, Mater. Res. Soc. Symp. Proc., 607, K.2.2.1 (2001).
7. D.-H. Kuo, K.-H. Tzeng, and C.-H. Chien, J. Vac. Sci. Technol. A, 21, 1996 (2003).
8. D.-H. Kuo and K.-H. Tzeng, Thin Solid Films, 460, 327 (2004).
9. N. V. Nguyen, J.-P. Han, J. Y. Kim, E. Wilcox, Y. J. Cho, W. Zhu, Z. Luo, and T. P. Ma, AIP Conf. Proc., 683, 181 (2003).
10. D. H. Kuo and K. H. Tzeng, Thin Solid Films, 420-421, 497 (2002).
11. O. Auciello, W. Fan, B. Kabius, S. Saha, J. A. Carlisle, R. P. H. Chang, C. Lopez, E. A. Irene, and R. A. Baragiola, Appl. Phys. Lett., 86, 042904 (2005).
12. D.-H. Kuo and C.-N. Shueh, J. Non-Cryst. Solids, 336, 120 (2004).
13. Y. S. Kim and S. Jin Yun, J. Cryst. Growth, 274, 585 (2005).
14. G. K. Dalapati, S. Chatterjee, S. K. Samanta, and C. K. Maiti, Appl. Surf. Sci., 210, 249 (2003).
15. M. N. L. Niinistö, J. Päiväsaari, J. Niinistö, M. Putkonen, and M. Nieminen, Phys. Status Solidi A, 201, 1443 (2004).
16. Y. Senzaki, S. Park, H. Chatham, L. Bartholomew, and W. Nieveen, J. Vac. Sci. Technol. A, 22, 1175 (2004).
17. K. A. Son, A. Y. Mao, B. Y. Kim, F. Liu, E. D. Pylant, D. A. Hess, J. M. White, D. L. Kwong, D. A. Roberts, and R. N. Vrtis, in Papers from the 44th National Symposium of the AVS, Vol. 16, p. 1670, San Jose, CA (1998).
18. X. Song and C. G. Takoudis, Presented in the 52nd AVS International Symposium, AVS, Boston, MA (2005).
19. A. Deshpande, Ph.D. Thesis, Department of Chemical Engineering, University of Illinois at Chicago, Chicago, IL (2005).
20. P. Young-Bae, K. H. Ahn, and P. Dong-Wha, J. Mater. Sci. Lett., V22, 1325 (2003).
21. M.-K. Lee, J.-J. Huang, and T.-S. Wu, Semicond. Sci. Technol., 20, 519 (2005).
22. W. C. Hyun and C. D. Jin, Yoop Hakhoechi, 35, 88 (1998).
23. S. A. Campbell, H. S. Kim, D. C. Gilmer, B. He, T. Ma, and W. L. Gladfelter, IBM J. Res. Dev., 43, 383 (1999).
24. Y. Leprince-Wang and K. Yu-Zhang, Surf. Coat. Technol., 140, 155 (2001).
25. I. Yoshizumi, H. Hideyasu, and S. Yoshiyuki, J. Sol-Gel Sci. Technol., V19, 365 (2000).
26. R. C. Abhijit, Ph.D. Thesis, Department of Chemical Engineering, University of Illinois at Chicago, Chicago, IL (2003).
27. X. Song and C. G. Takoudis, J. Vac. Sci. Technol. A, In press.
28. T. M. Klein, D. Niu, W. S. Epling, W. Li, D. M. Maher, C. C. Hobbs, R. I. Hegde, I. J. R. Baumvol, and G. N. Parsons, Appl. Phys. Lett., 75, 4001 (1999).
29. W. R. Salaneck, R. Bergman, J. E. Sundgren, A. Rockett, T. Motooka, and J. E. Greene, Surf. Sci., 198, 461 (1988).