Dynamic surface temperature measurements in ICs

Proceedings of the IEEE

Volumn 94, Issue 8, 2006, Pages 1519-1532

  Altet, Josep ^a   Claeys, Wilfrid ^b   Dilhaire, Stefan ^b   Rubio, Antonio ^a  

^a UNIVERSITAT POLITÈCNICA DE CATALUNYA   (Spain)

^b UNIVERSITÉ DE BORDEAUX   (France)

Author keywords

CMOS temperature sensors; Differential temperature sensors; Integrated circuits (ICs); Laser interferometry; Laser thermoreflectance; Temperature measurements

Indexed keywords

CMOS INTEGRATED CIRCUITS; EQUIPMENT TESTING; FAILURE ANALYSIS; INTEGRATED CIRCUITS; LASER INTERFEROMETRY;

CMOS TEMPERATURE SENSORS; DIFFERENTIAL TEMPERATURE SENSORS; LASER THERMOREFLECTANCE;

TEMPERATURE MEASUREMENT;

EID: 33947259974     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/JPROC.2006.879793     Document Type: Article

References (68)

1. J. M. Soden and R. E. Anderson, "IC failure, analysis: Techniques and tools for quality reliability improvement," Proc. IEEE, vol. 81, no. 5, pp. 703-715, May 1993.
2. J. Hiatt, "A method of detecting hot spots on semiconductors using liquid crystals," In Proc. 19th Annu. IEEE Reliability Physics Symp., 1981, pp. 130-133.
3. D. H. Lee, "Thermal analysis of Integrated circuit chips using thermographic imaging techniques," IEEE Trans. Instrum. Meas., vol. 43, no. 6, pp. 824-829, Dec. 1994.
4. P. Kolodner and I. A. Tyson, "Microscopic fluorescent imaging of surface temperature profiles with 0.01 °C resolution," Appl. Phys. Lett., vol. 40, no. 9, pp. 782-784, 1982.
5. J. Christofferson and A. Shakouri, "Thermal measurements of active semiconductor micro-structures acquired through the substrate using near IR thermoreflectancc," Microelectron. J., vol. 35, no. 10, pp. 791-796, Oct. 2004.
6. J. Altet, A. Rubio, E. Schaub, S. Dilhaire, and W. Claeys, "Thermal coupling in integrated circuits: application to thermal testing," IEEE J. Solid-State Circuits, vol. 36, no. 1, pp. 81-91, Jan. 2001.
7. D. J. Walkey, T. S. Smy, R. G. Dickson, J. S. Brodsky, D. T. Zweidinger, and R. M. Fox, "Equivalent circuit modeling of static substrate thermal coupling using VCVS representation," IEEE J. Solid-State Circuits, vol. 37. no. 9, pp. 1198-1205, Sep. 2002.
8. N. Nenadovic, S. Mijalkovic, L. K. Nanver, L. K. I. Vandamme, V. d'Alcssandro, H. Schellevis, and J. W. Slotboom, "Extraction and modeling of self-heating and mutual thermal coupling impedance of bipolar transistors," IEEE J. Solid-State Circuits, vol. 39, no. 10, pp. 1764-1772, Oct. 2004.
9. F. F. Oettinger and D. L. Blackburn, "Semiconductor measurement technology: thermal resistance measurements, NIST Special Publication 400-86, Jul. 1990.
10. T. S. Fisher, C. T. Avedisian, and I. P. Krusius, "Transient thermal response due to periodic heating on a convectively cooled substrate," IEEE Trans. Compon., Packag., Manuf. Technol. B, vol. 19, no. 1, pp. 255-261, Feb. 1996.
11. M. Rencz and V. Székely, "Studies on the 'nonlinearity effects in dynamic compact model generation of packages," IEEE Trans. Compon. Packag. Technol., vol. 27, no. 1, pp. 124-130, Mar. 2004.
12. V. Székely and M. Renz, "Increasing the accuracy of thermal transient measurements," IEEE Trans. Compon. Packag. Technol., vol. 25, no. 4, pp. 539-546, Dec. 2002.
13. M. R. Rencz and V. Székely, "Measuring partial thermal resistance in a heat-flow path," IEEE Trans. Compon. Packag. Technol., vol. 25, no. 4, pp. 547-553, Dec. 2002.
14. K. Kurabayashi and K. E. Goodson, "Precision measurement and mapping of die-attach thermal resistance," IEEE Trans. Compon., Packag., Manuf. Technol. A, vol. 21, no. 3, pp. 506-514, Sep. 1998.
15. M. Carmona, S. Marco, J. Palacín, and J. Samitier, "A time-domain method for the analysis of thermal Impedance response preserving the convolution form," IEEE Trans. Compon, Packag. Technol., vol. 22, no. 2, pp. 238-244, Jun. 1999.
16. Pentium III processor active thermal management techniques (application note), Aug. 2000, order no. 273405-001.
17. S. L. Buedo, J. Garrido, and E. I. Boemo, "Dynamically Inserting, operating and eliminating thermal sensors on FPGA based systems," IEEE Trans. Compon. Packag, Technol., vol. 26, no. 4, pp. 561-566, Dec. 2002.
18. J. Altet and A. Rubio, Thermal Testing of IC. Norwell, MA: Kluwer, 2002.
19. _, "Differential sensing strategy for dynamic thermal testing of ICs," In Proc. 15th IEEE VLSI Test Symp., 1997, pp. 434-439.
20. D. Mateo, I. Altet, and E. Aldrete-Vidrio, "An approach to the electrical characterization of analog blocks through thermal measurements," in Proc. 11th THERMINIC Workshop. 2005, pp. 59-64.
21. J. Christofferson and A. Shakouri, "Thermal measurements of active semiconductor micro-structures acquired through the substrate using near IR thermoreflectance," Microeleclron. J., vol. 35, no. 10, pp. 791-796, Oct. 2004.
22. X. Perpinà, X. Jordà, N. Mestres, M. Vellvehi, P. Godignon, J. Millán, and H. von Kiedrowski, "Internal infrared laser deflection system: a tool for power device characterization," Meas. Sci. Technol., vol. 15, no. 5, pp. 1011-1018.
23. M. Nishiguchi, M. Fujihara, A. Miki, and II. Nishizawa, "Precision comparison of surface temperaure measurement techniques for GaAs IC's," IEEE Trans. Compon., Hybrids, Manuf. Technol., vol. 16, no. 5, pp. 543-549, Aug. 1993.
24. W. Chen, H. Cheng, and H. Shen, "An effective methodology for thermal characterization of electronic packaging," IEEE Trans. Compon., Hybrids, Manuf. Technol. vol. 26. no. 1, pp. 222-232, Mar. 2003.
25. V. Szckely and M. Rencz, "Image processing procedures for the thermal measurements," IEEE Trans. Compon., Hybrids, Manuf. Technol., vol. 22, no. 2, pp. 259-265, Jun. 1999.
26. I. Lai, M. Chandrachood, A. Majumdar, and I. P. Carrejo, "Thermal detection of device failure by atomic force microscopy," IEEE Electron Device Lett., vol. 16, no. 7, pp. 312-315, Jul. 1995.
27. J. Altet, I. M. Rampnoux, J. C. Batsale, S. Dilhaire, A. Rubio, W. Claeys, and S. Grauby, "Applications of temperature phase measurements to IC testing," Microelectron. Reliab., vol. 44, pp. 95-103, 2004.
28. S. Dilhaire, S. Grauby, W. Claeys, and J. C. Batsale, "Thermal parameters identification of micrometric layers of microelectronic devices by thermoreflectance," Microsc. Microelectron. J., vol. 35, no. 10, pp. 811-816, Oct. 2004.
29. L. D. Patino Lopez, S. Grauby, S. Dilhaire, M. A. Salhi, W. Claeys, S. Lefèvre, and S. Volz, "Characterization of the thermal behavior of PN thermoelectric couples by scanning thermal microscope," Microelectron. J., vol. 35, no. 10, pp. 797-803, Oct. 2004.
30. W. Claeys, S. Dilhaire, V. Quintard, and Y. Danto, " Thermoreflectance optical test probe for the measurement of current induced temperature changes in microelectronic components," Qual. Reliab. Eng. Int., vol. 9, pp. 303-308, 1993.
31. W. Claeys, S. Dilhaire, and V. Quintard, "Laser probing of thermal behaviour of electronic components and its application in quality and reliability testing," Microelectron. Eng., vol. 24, pp. 411-420, 1994.
32. W. Claeys, S. Dilhaire, V. Quintard, J. P. Dom, and Y. Danto, "Thermoreflectance optical test probe for the measurement of current induced temperature changes in microelectronic components," Qual. Reliab. Eng. Int., vol. 9, pp. 303-308, 1993.
33. V. Quintard, G. Deboy, S. Dilhaire, D. Lewis, T. Phan, and W. Claeys, "Laser beam thermography of circuits in the particular case of passivated semiconductors," Microelectron. Eng., vol. 31, pp. 291-298, 1996.
34. S. Grauby, S. Dilhaire, S. Jorez, and W. Claeys, "Imaging setup for temperature, topography, and surface displacement measurements of microelectronic devices," Rev. Sci. Instrum., vol. 74, no. 1, pp. 645-647, Jan. 2003.
35. W. Claeys, S. Dilhaire, S. Jorez, and L.-D. Patino-Lopez, "Laser probes for the thermal and thermomechanical characterisation of microelectronic devices," Microelectroni J., vol. 32, no. 10-11, pp. 891-898, Oct.-Nov. 2001.
36. A. Rosencwaig, J. Opsal, N. L. Smith, and D. L. Willenborg, "Detection of thermal waves through optical reflectance," Appl. Phys. Lett., vol. 46, pp. 1013, 1985.
37. H. A. Weakliem and D. Redfield, "Temperature dependence of the optical properties of silicon," J. Appl. Phys., vol. 50, no. 3, pp. 1491, 1979.
38. S. Dilhaire, S. Jorez, L. D. Patiño-Lopez, W. Claeys, and E. Schaub, "Calibration procedure of temperature measurements by thermoreflectance upon microelectronic devices." presented at the 11th Int. Conf. Photoacoustic and Photothermal Phenomena, Kyoto, Japan, 2000.
39. S. Dilhaire, E. Schaub, W. Claeys, J. Altet, and A. Rubio, "Localisation of heat sources in electronicrcuits by microthermal laser probing," Int. J. Therm. Sci., vol. 39, pp. 544-549, 2000.
40. S. Dilhaire, J. Altet, S. Jorez, E. Schaub, A. Rubio, and W. Claeys, "Fault localisation in IC's by goniometrlc laser probing of thermal induced surface waves," Aficroelectron. Reliab., vol. 39, pp. 919-923, 1999.
41. J. Altet, M. A. Salhi, S. Dilhaire, and A. Ivanov, "Calibration-free heat source localization in ICs entirely covered by metal layers," Electron. Lett., vol. 40, no. 4, pp. 241-242, Feb. 19, 2004.
42. I. Altet, A. Rubio, A. Salhi, J. L. Galvez, S. Dilhaire, A. Syal, and A. Ivanov, "Sensing temperature In CMOS circuits for thermal testing," in Proc. 22nd IEEE VLSI Test Symp., 2004, pp. 179-184.
43. S. Dilhaire, S. Grauby, S. Jorez, L. D. P. Lopez, J.-M. Rampnoux, and W. Claeys, "Surface displacement Imaging by interferometry with a light emitting diode," Appl. Opt., vol. 41, no. 24, pp. 4996-5001, Aug. 20, 2002.
44. V. Székely, C. Márta, M. Rencz, Z. Benedek, and B. Courtois, "Design for thermal testability (DOT) and a CMOS realization," Sens. Actuators, vol. A55, no. 1, pp. 29-34, 1996.
45. G. C. M. Meijer, G. Wang, and F. Fruett, "Temperature sensors and voltage references implemented in CMOS technology," IEEE Sensors J., vol. 1, no. 3, pp. 225-234, Oct. 2001.
46. A. Bakker and J. H. Huijsing, "Micropower CMOS temperature sensor with digital output," IEEE J. Solid-State Circuits, vol. 31, no. 7, pp. 933-937, Jul. 1996.
47. R. A. Blanchi, I. M. Karam, B. Courtois, R. Nadal, F. Pressecq, and S. Sifflet, "CMOS-compatible temperature sensor with digital output for wide temperature range applications," Microelectron. J., vol. 31, no. 9-10, pp. 803-810, Oct. 2000.
48. P. E. Bagnoli, C. Casarosa, E. Dallago, and M. Nardonl, "Thermal resistance analysis by Induced transient (TRAIT) method for power electronic devices thermal characterization-Part II: Practice and experiments," IEEE Trans. Power Electron., vol. 13, no. 6, pp. 1220-1228, Nov. 1998.
49. Y. P. Tsividis, Operation and Modeling of the MOS Transistor. New York: McGraw-Hill, 1987.
50. I. M. Filanovsky and A. Allan, "Mutual compensation of mobility and threshold voltage temperature effects with application In CMOS circuits," IEEE Trans. Circuits Syst. I, Fundam. Theory Appl., vol. 48, no. 7, pp. 876-884, Jul. 2001.
51. I. M. Filanovsky and S. T. Lim, "Temperature sensor applications of diode-connected MOS transistors," in IEEE Int. Symp. Circuits and Systems, 2002, pp. II-149-II-152.
52. V. Székely, C. Marta, Z. Kohari, and M. Rencz, "CMOS sensors for on-line thermal monitoring of VLSI circuits," IEEE Trans. Very Large Scale Inregr. (VLSI) Syst., vol. 5, no. 3, pp. 270-276, Sep. 1997.
53. P. Antognetti, G. R. Bisio, F. Curatelli, and S. Palara, "Three-dimensional transient thermal simulation: Application to delayed short circuit protection in power ICs," IEEE J. Solid-Stole Circuits, vol. SC-15, no. 3, pp. 277-281, Jun. 1980.
54. J. Altet, D. Mateo, and J. J. Gonzalez, "Observation of high-frequency analog/RF electrical circuit characteristics by on-chip thermal measures," In Proc. ISCAS 2006.
55. M. V. Arx, O. Paul, and H. Baltes, "Test structures to measure the Seebeck coefficient of CMOS IC polysilicon," IEEE Trans. Semicond. Manuf., vol. 10, no. 2, pp. 201-208, May 1997.
56. A. Syal, V. Lee, A. Ivanov, and I. Altet, "CMOS differential and absolute thermal sensor," J. Electron. Testing: Theory Appl., vol. 18, pp. 295-304, 2002.
57. O. Breitenstein, M. Langenkamp, F. Altmann, D. Katzer, A. Lindner, and H. Eggers, "Microscopic lock-in thermography investigation of leakage sites in integrated circuits," Reu. Sci. Instrum., vol. 7, no. 11, pp. 4155-4160, Nov. 2000.
58. K. Arabi and B. Kaminska, "Built-in temperature and current sensors for on-line oscillation-testing," in Proc. 2nd IEEE Int. On-line Testing Workshop, 1996, pp. 13-16.
59. D. L. Blackburn, "Temperature measurements of semiconductor devices - A review," in Proc. 20th SEMITHERM Symp., 2004, pp. 70-80.
60. S. Volz, S. Dilhaire, S. Lefebvre, and L. D. Patino-Lopez, Scanning thermal microscopy applied to thin films and electronic devices characterization," Handbook of Semiconductor Nanostructures and Nanodevices, A. A. Balandin and K. L. Wang, Eds. North Lewis Way, CA: American Scientific, ch. 29.
61. I. Abbadi, "New imaging method for diffusive and opaque media: Application to backside imaging of Integrated circuits," Ph.D. dissertation, Univ. Bordeaux 1, Bordeaux, France, 2005.
62. J. Altet, S. Dilhaire, S. Volz, J. M. Rampnoux, A. Rubio, S. Grauby, L. D. Patino-López, W. Claeys, and J. B. Saulnier, "Four different approaches for the measurement of IC surface temperature: Application to thermal testing," Microelecrron. J., vol. 33, pp. 689-696, 2002.
63. J. Altet, M. A. Salhi, S. Dilhaire, A. Syal, and A. Ivanov, "Localisation of devices acting as heat sources in ICs covered enterely by metal layers," Electron. Lett., vol. 39, no. 20, pp. 1140-1442, 2003.
64. H. S. Carslaw and J. C. Jaeger, Conduction Heat In Solids. New York: Oxford, 1993.
65. E. Aldrete, J. Altet, and D. Mateo, "Differential temperature sensors in 0.35 μm CMOS technology," in Proc. IEEE THERMINIC 2005 Conf., pp. 122-128.
66. K. R. Laker and W. Sansen, Design of Analog Integrated Circuits and Systems. New York: Me Graw-Hill, 1994.
67. P. Jeong, W. S. Moo, and C. C. Lee, "Thermal modeling and measurement of GaN-based HFET devices," IEEE Electron Device Lett.. vol. 24, no. 7, pp. 424-426, Jul. 2003.
68. A. M. Chaudhari, T. M. Woudenberg, M. Albin, and K. E. Goodson, "Transient liquid crystal thermometry of microfabricated PCR vessel arrays," J. Microelectromech. Syst., vol. 7, no. 4, pp. 345-355, 1998.