Precision measurement and mapping of die-attach thermal resistance

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 3, 1998, Pages 506-513

  Kurabayashi, Katsuo ^a   Goodson, Kenneth E ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

Die attachment; Die attach adhesives; Electrical resistance thermometry; Packaging design; Photothermal reflectance thermometry; Thermal resistance

Indexed keywords

ADHESIVES; DELAMINATION; HEAT RESISTANCE; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL VARIABLES MEASUREMENT;

DIE ATTACH ADHESIVES; PHOTOTHERMAL REFLECTANCE THERMOMETRY;

ELECTRONICS PACKAGING;

EID: 0032156196     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.725215     Document Type: Article

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