Thermal measurements of active semiconductor micro-structures acquired through the substrate using near IR thermoreflectance

Microelectronics Journal

Volumn 35, Issue 10, 2004, Pages 791-796

  Christofferson, James ^a   Shakouri, Ali ^a  

^a University of California Santa Cruz   (United States)

Author keywords

Backside thermal imaging; Photothermal imaging; Thermoreflectance

Indexed keywords

FLIP CHIP DEVICES; FLUORESCENCE; INFRARED IMAGING; MICROSCOPIC EXAMINATION; MICROSTRUCTURE; SEMICONDUCTOR MATERIALS; SILICON; SUBSTRATES; THERMAL EFFECTS;

BACKSIDE THERMAL IMAGING; PHOTOTHERMAL IMAGING; THERMAL CHARACTERIZATION; THERMOREFLECTANCE;

MICROELECTRONICS;

EID: 4444224928     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2004.06.009     Document Type: Conference Paper

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