Sensing temperature in CMOS circuits for thermal testing

Proceedings of the IEEE VLSI Test Symposium

Volumn , Issue , 2004, Pages 179-184

  Altet, J ^a   Rubio, A ^a   Salhi, A ^b   Galvez J L ^a   Dilhaire, S ^b   Syal, A ^c   Ivanov, A ^c  

^a UNIVERSITAT POLITÈCNICA DE CATALUNYA   (Spain)

^b UNIVERSITÉ DE BORDEAUX   (France)

^c UNIVERSITY OF BRITISH COLUMBIA   (Canada)

Author keywords

Analysis failure; Built in selftest; Temperature sensors; Thermal testing

Indexed keywords

ANALYSIS FAILURE; INFRARED THERMOGRAPHY; TEMPERATURE SENSORS; THERMAL TESTING;

BUILT-IN SELF TEST; INTERFEROMETERS; PHOTODIODES; SENSORS; TEMPERATURE MEASUREMENT; THERMAL EXPANSION; THRESHOLD VOLTAGE; TRANSDUCERS;

CMOS INTEGRATED CIRCUITS;

EID: 3142754296     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/VTEST.2004.1299241     Document Type: Conference Paper

References (17)

1. J. Altet and A. Rubio, "Thermal testing of integrated circuits", Kluwer editors, 2002.
2. M. Rencz, "New possibilities in the thermal evaluation, offered by transient testing", Microelectronics Journal, 34, 2003, 171-177.
3. J. Altet, et al., "Applications of temperature phase measurements to IC testing", Microelectronics Reliability, Volume 44, Issue 1, January 2004, Pages 95-10.
4. J. Altet, A. Rubio, S. Dilhaire, E. Schaub, W. Claeys, "Thermal Testing, Application to IC Diagnosis", 18th VLSI Test Symposium, 30 April - 4 May 2000, Montréal, Canada, ISBN: 0-7695-0613-5, pp. 189-193.
5. J. Altet et al. "Four different approaches for the measurement of IC surface temperature: application to thermal testing", Microelectronics Journal, Volume 33, Issue 9, 1 September 2002, Pages 689-696.
6. P. Kolodner, J.A. Tyson, "Remote thermal imaging with 0.7 μm spatial resolution using temperature dependent fluorescent thin films", Appl. Phys. Lett. 42(1), 1 Jan. 1983, pp. 117-119.
7. J. Hyatt, "A method of detecting hot spots on semiconductors using liquid crystals", Proc. Int. Rel. Phys. Symp. April 1981, 130-133.
8. Szekely, V.; Rencz, M.; "Image processing procedures for the thermal measurements", IEEE Trans. on Components and Packaging Technologies, Vol.: 22, no. 2, June 1999 Pg.:259-265.
9. J. Altet and A. Rubio. "Differential Sensing Strategy for Dynamic Thermal Testing of ICs", Proceedings of the 15th. IEEE VLSI Test Symposium, April 27- May 1, 1997. Monterey (USA), pp. 434-439.
10. S. Dilhaire, "Développement d'un interféromètre très haute résolution pour la caractérisation de composants microélectroniques", (Ph.D. Thesis. n° 1103 Université Bordeaux 1, 1994).
11. nd October, 2003, pp. 1440-1442.
12. J. Altet et al. "Calibration-free heat source localization in ICs enterelly covered by metal layers". To be published in IEE Electronic Letters.
13. th June 1998, pp. 1307-1309.
14. J. Altet, et al. "Thermal testing: fault location strategies", IEEE J. On Solid-State Circuits, volume 36, issue 1. January 2001, pp. 81-91.
15. Y.P. Tsividis, "Operation and modelline of the MOS transistor". McGraw-Hill, 1989.
16. P.M. Klaasen, "MOS devices modelling", Design of VLSI circuits for communications, Prentice Hall, 1995.
17. F.M. Klaasen and W. Hes, "On the temperature coefficient of the MOSFET threhold voltage", Solid State Electronics, vol. 29, 99. 787-789, 1986.