Calibration-free heat source localisation in ICs entirely covered by metal layers

Electronics Letters

Volumn 40, Issue 4, 2004, Pages 241-242

  Altet, J ^a   Salhi, M A ^b   Dilhaire, S ^b   Ivanov, A ^c  

^a UNIVERSITAT POLITÈCNICA DE CATALUNYA   (Spain)

^b UNIVERSITÉ DE BORDEAUX   (France)

^c UNIVERSITY OF BRITISH COLUMBIA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY DISSIPATION; INTERFEROMETRY; MICROPROCESSOR CHIPS; PHASE MEASUREMENT; PHASE SHIFT; PHOTODETECTORS; SILICON; THERMAL EXPANSION;

HEAT SOURCE LOCALIZATIONS; HOT SPOTS; METAL LAYERS;

CMOS INTEGRATED CIRCUITS;

EID: 1542686182     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:20040172     Document Type: Article

References (4)

1. Soden, J.M., and Andersen, R.E.: IC failure analysis: techniques and tools for quality and reliability improvement', Proc. IEEE, 1993, 81, (5), pp. 703-715
2. Altet, J., Salhi, M.A., Dilhaire, S., Syal, A., and Ivanov, A.: 'Localisation of devices acting as heat sources in ICs covered entirely by metal layers', Electron. Lett., 2003, 39, (20), pp. 1440-1442
3. Altet, J., Dilhaire, S., Volz, S., Rampnoux, J.M., Rubio, A., Grauby. S., Patino, L.D., Claeys, W., and Saulnier, J.B.: 'Four different approaches for the measurement of IC surface temperature: application to thermal testing', Microelectron. J., 2002, 33, pp. 689-696
4. Dilhaire, S.: 'Développement d'un interféromètre très haute résolution pour la caractérisation de composants microélectroniques'. PhD thesis, No. 1103, Université Bordeaux 1, 1994