Studies on the nonlinearity effects in dynamic compact model generation of packages

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 1, 2004, Pages 124-130

  Rencz, Márta ^a   Székely, Vladimir ^b  

^a MicReD Ltd   (Hungary)

^b BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

Compact thermal modeling; Dynamic compact models; Nonlinear compact models; Temperature dependent models

Indexed keywords

ALLOYS; ALUMINA; BERYLLIUM COMPOUNDS; CERAMIC MATERIALS; COMPUTER SIMULATION; MATHEMATICAL MODELS; SPECIFIC HEAT OF SOLIDS; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EFFECTS;

COMPACT THERMAL MODELLING; DYNAMIC COMPACT MODEL; NONLINEAR COMPACT MODEL; TEMPERATURE DEPENDENT MODEL;

ELECTRONICS PACKAGING;

EID: 2442447000     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.825750     Document Type: Article

References (9)

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