-
1
-
-
33947231685
-
-
International Technology Roadmap for Semiconductors
-
International Technology Roadmap for Semiconductors, 2005.
-
(2005)
-
-
-
2
-
-
33747557398
-
High-performance interconnects: An integration overview
-
R. H. Havemann and J. A. Hutchby, "High-performance interconnects: an integration overview," Proceedings of the IEEE, vol. 89, pp. 586-601, 2001.
-
(2001)
Proceedings of the IEEE
, vol.89
, pp. 586-601
-
-
Havemann, R.H.1
Hutchby, J.A.2
-
3
-
-
0033677323
-
Low dielectric constant materials for ULSI interconnects
-
M. Morgen, E. T. Ryan, J. H. Zhao, C. Hu, T. Cho, and P. S. Ho, "Low dielectric constant materials for ULSI interconnects," Annual Review of Materials Science, vol. 30, pp. 645, 2000.
-
(2000)
Annual Review of Materials Science
, vol.30
, pp. 645
-
-
Morgen, M.1
Ryan, E.T.2
Zhao, J.H.3
Hu, C.4
Cho, T.5
Ho, P.S.6
-
4
-
-
0037666297
-
Low dielectric constant materials for microelectronics
-
K. Maex, M. R. Baklanov, D. Shamiryan, F. Lacopi, S. H. Brongersma, and Z. S. Yanovitskaya, "Low dielectric constant materials for microelectronics," Journal of Applied Physics, vol. 93, pp. 8793, 2003.
-
(2003)
Journal of Applied Physics
, vol.93
, pp. 8793
-
-
Maex, K.1
Baklanov, M.R.2
Shamiryan, D.3
Lacopi, F.4
Brongersma, S.H.5
Yanovitskaya, Z.S.6
-
5
-
-
0037104274
-
Size-dependent resistivity of metallic wires in the mesoscopic range
-
W. Steinhögl, G. Schindler, G. Steinlesberger, and M. Engelhardt, "Size-dependent resistivity of metallic wires in the mesoscopic range," Physical Review. B, Condensed Matter, vol. 66, pp. 075414, 2002.
-
(2002)
Physical Review. B, Condensed Matter
, vol.66
, pp. 075414
-
-
Steinhögl, W.1
Schindler, G.2
Steinlesberger, G.3
Engelhardt, M.4
-
6
-
-
1642397073
-
Alteration of Cu conductivity in the size effect regime
-
S. M. Rossnagel and T. S. Kuan, "Alteration of Cu conductivity in the size effect regime," Journal of Vacuum Science & Technology. B, Microelectronics Processing and Phenomena, vol. 22, pp. 240, 2004.
-
(2004)
Journal of Vacuum Science & Technology. B, Microelectronics Processing and Phenomena
, vol.22
, pp. 240
-
-
Rossnagel, S.M.1
Kuan, T.S.2
-
7
-
-
29244444803
-
Scaling Analysis of Multilevel Interconnect Temperatures for High-Performance ICs
-
S. Im, N. Srivastava, K. Banerjee, and K. E. Goodson, "Scaling Analysis of Multilevel Interconnect Temperatures for High-Performance ICs," IEEE Transactions on Electron Devices, vol. 52, pp. 2710, 2005.
-
(2005)
IEEE Transactions on Electron Devices
, vol.52
, pp. 2710
-
-
Im, S.1
Srivastava, N.2
Banerjee, K.3
Goodson, K.E.4
-
8
-
-
33846163817
-
Containing the finite size effect in copper lines
-
C. B. Alers, J. Sukamto, S. Park, C. Harm, and J. Reid, "Containing the finite size effect in copper lines," Semiconductor International, vol. 29, pp. 38-42, 2006.
-
(2006)
Semiconductor International
, vol.29
, pp. 38-42
-
-
Alers, C.B.1
Sukamto, J.2
Park, S.3
Harm, C.4
Reid, J.5
-
9
-
-
79956017414
-
Reduced electromigration of Cu wires by surface coating
-
C. K. Hu, L. Gignac, R. Rosenberg, E. Liniger, J. Rubino, C. Sambucetti, A. Domenicucci, X. Chen, and A. K. Stamper, "Reduced electromigration of Cu wires by surface coating," Applied Physics Letters, vol. 81, pp. 1782, 2002.
-
(2002)
Applied Physics Letters
, vol.81
, pp. 1782
-
-
Hu, C.K.1
Gignac, L.2
Rosenberg, R.3
Liniger, E.4
Rubino, J.5
Sambucetti, C.6
Domenicucci, A.7
Chen, X.8
Stamper, A.K.9
-
10
-
-
0016940795
-
Electromigration in thin Aluminum fims on Titanium Nitride
-
I. A. Blech, "Electromigration in thin Aluminum fims on Titanium Nitride," Journal of Applied Physics, vol. 47, pp. 1203-8, 1976.
-
(1976)
Journal of Applied Physics
, vol.47
, pp. 1203-1208
-
-
Blech, I.A.1
-
11
-
-
0035971713
-
Direct observation of a critical length effect in dual-damascene Cu/oxide interconnects
-
E. T. Ogawa, A. J. Bierwag, K. D. Lee, H. Matsuhashi, P. R. Justison, A. N. Ramamurthi, P. S. Ho, V A, D. Griffiths, A. Nelsen, M. Breen, and R. H. Havemann, "Direct observation of a critical length effect in dual-damascene Cu/oxide interconnects," Applied Physics Letters, vol. 78, pp. 2652, 2001.
-
(2001)
Applied Physics Letters
, vol.78
, pp. 2652
-
-
Ogawa, E.T.1
Bierwag, A.J.2
Lee, K.D.3
Matsuhashi, H.4
Justison, P.R.5
Ramamurthi, A.N.6
Ho, P.S.7
Griffiths, V.A.D.8
Nelsen, A.9
Breen, M.10
Havemann, R.H.11
-
12
-
-
17444366307
-
Molecular electronics: From devices and interconnect to circuits and architecture
-
M. R. Stan, P. D. Franzon, S. C. Goldstein, J. C. Lach, and M. M. Ziegler, "Molecular electronics: from devices and interconnect to circuits and architecture," Proceedings of the IEEE, vol. 9, pp. 1940, 2003.
-
(2003)
Proceedings of the IEEE
, vol.9
, pp. 1940
-
-
Stan, M.R.1
Franzon, P.D.2
Goldstein, S.C.3
Lach, J.C.4
Ziegler, M.M.5
-
13
-
-
0038281253
-
A comparison of potential molecular wires as components for molecular electronics
-
N. Robertson and C. A. McGowan, "A comparison of potential molecular wires as components for molecular electronics," Chemical Society Reviews, vol. 32, pp. 96-103, 2003.
-
(2003)
Chemical Society Reviews
, vol.32
, pp. 96-103
-
-
Robertson, N.1
McGowan, C.A.2
-
14
-
-
0042322640
-
Measurement of single-molecule resistance by repeated formation of molecular junctions
-
B. Q. Xu and N. J. J. Tao, "Measurement of single-molecule resistance by repeated formation of molecular junctions," Science, vol. 301, pp. 1221-1223, 2003.
-
(2003)
Science
, vol.301
, pp. 1221-1223
-
-
Xu, B.Q.1
Tao, N.J.J.2
-
15
-
-
0034735798
-
Electronics using hybrid-molecular and mono-molecular devices
-
C. Joachim, J. K. Gimzewski, and A. Aviram, "Electronics using hybrid-molecular and mono-molecular devices," Nature, vol. 408, pp. 541-548, 2000.
-
(2000)
Nature
, vol.408
, pp. 541-548
-
-
Joachim, C.1
Gimzewski, J.K.2
Aviram, A.3
-
16
-
-
0001376751
-
Construction of highly conductive nanowires on a DNA template
-
J. Richter, M. Mertig, W. Pompe, I. Monch, and H. K. Schackert, "Construction of highly conductive nanowires on a DNA template," Applied Physics Letters, vol. 78, pp. 536-8, 2001.
-
(2001)
Applied Physics Letters
, vol.78
, pp. 536-538
-
-
Richter, J.1
Mertig, M.2
Pompe, W.3
Monch, I.4
Schackert, H.K.5
-
17
-
-
0037308118
-
Metallization of DNA
-
J. Richter, "Metallization of DNA," Physica. E, Low-dimensional Systems & Nanostructures, vol. 16, pp. 157-73, 2003.
-
(2003)
Physica. E, Low-dimensional Systems & Nanostructures
, vol.16
, pp. 157-173
-
-
Richter, J.1
-
18
-
-
0032490948
-
Design and self-assembly of two-dimensional DNA crystals
-
E. Winfree, F. R. Liu, L. A. Wenzler, and N. C. Seeman, "Design and self-assembly of two-dimensional DNA crystals," Nature, vol. 394, pp. 539-44, 1998.
-
(1998)
Nature
, vol.394
, pp. 539-544
-
-
Winfree, E.1
Liu, F.R.2
Wenzler, L.A.3
Seeman, N.C.4
-
19
-
-
21244484682
-
In situ resistance measurements of epitaxial cobalt silicide nanowires on Si
-
H. Okino, I. Matsuda, R. Hobara, Y. Hosomura, S. Hasegawa, and P. A. Bennett, "In situ resistance measurements of epitaxial cobalt silicide nanowires on Si(110)," Applied Physics Letters, vol. 86, pp. 233108, 2005.
-
(2005)
Applied Physics Letters
, vol.86
, pp. 233108
-
-
Okino, H.1
Matsuda, I.2
Hobara, R.3
Hosomura, Y.4
Hasegawa, S.5
Bennett, P.A.6
-
20
-
-
3142684485
-
Single-crystal metallic nanowires and metal/semiconductor nanowire heterostructures
-
Y. Wu, J. Xiang, C. Yang, W. Lu, and C. M. Lieber, "Single-crystal metallic nanowires and metal/semiconductor nanowire heterostructures," Nature, vol. 430, pp. 61-65, 2004.
-
(2004)
Nature
, vol.430
, pp. 61-65
-
-
Wu, Y.1
Xiang, J.2
Yang, C.3
Lu, W.4
Lieber, C.M.5
-
21
-
-
0007178040
-
Individual single-wall carbon nanotubes as quantum wires
-
S. J. Tans, M. H. Devoret, H. J. Dai, A. Thess, R. E. Smalley, L. J. Geerligs, and C. Dekker, "Individual single-wall carbon nanotubes as quantum wires," Nature, vol. 386, pp. 474-7, 1997.
-
(1997)
Nature
, vol.386
, pp. 474-477
-
-
Tans, S.J.1
Devoret, M.H.2
Dai, H.J.3
Thess, A.4
Smalley, R.E.5
Geerligs, L.J.6
Dekker, C.7
-
22
-
-
0032554876
-
Carbon nanotubes as long ballistic conductors
-
C. T. White and T. N. Todorov, "Carbon nanotubes as long ballistic conductors," Nature, vol. 393, pp. 240-2, 1998.
-
(1998)
Nature
, vol.393
, pp. 240-242
-
-
White, C.T.1
Todorov, T.N.2
-
23
-
-
0035920684
-
Reliability and current carrying capacity of carbon nanotubes
-
B. Q. Wei, R. Vajtai, and P. M. Ajayan, "Reliability and current carrying capacity of carbon nanotubes," Applied Physics Letters, vol. 79, pp. 1172-4, 2001.
-
(2001)
Applied Physics Letters
, vol.79
, pp. 1172-1174
-
-
Wei, B.Q.1
Vajtai, R.2
Ajayan, P.M.3
-
24
-
-
23344441873
-
Transport Effects on Signal Propagation in Quantum wires
-
S. Salahuddin, M. Lundstrom, and S. Datta, "Transport Effects on Signal Propagation in Quantum wires," IEEE Transactions on Electron Devices, vol. 52, pp. 1734-1742, 2005.
-
(2005)
IEEE Transactions on Electron Devices
, vol.52
, pp. 1734-1742
-
-
Salahuddin, S.1
Lundstrom, M.2
Datta, S.3
-
25
-
-
28344446515
-
Electrical contacts to carbon nanotubes down to 1nm in diameter
-
W. Kim, A. Javey, R. Tu, J. Cao, Q. Wang, and H. Dai, "Electrical contacts to carbon nanotubes down to 1nm in diameter," Applied Physics Letters, vol. 87, pp. 1-3, 2005.
-
(2005)
Applied Physics Letters
, vol.87
, pp. 1-3
-
-
Kim, W.1
Javey, A.2
Tu, R.3
Cao, J.4
Wang, Q.5
Dai, H.6
-
26
-
-
27144461665
-
Multichannel ballistic transport in multiwall carbon nanotubes
-
H. J. Li, W. G. Lu, J. J. Li, X. D. Bai, and C. Z. Gu, "Multichannel ballistic transport in multiwall carbon nanotubes," Physical Review Letters, vol. 95, pp. 086601, 2005.
-
(2005)
Physical Review Letters
, vol.95
, pp. 086601
-
-
Li, H.J.1
Lu, W.G.2
Li, J.J.3
Bai, X.D.4
Gu, C.Z.5
-
28
-
-
23844492770
-
Monolayer metallic nanotube interconnects: Promising candidates for short local interconnects
-
A. Naeemi and J. D. Meindl, "Monolayer metallic nanotube interconnects: promising candidates for short local interconnects," IEEE Electron Device Letters, vol. 26, pp. 544-546, 2005.
-
(2005)
IEEE Electron Device Letters
, vol.26
, pp. 544-546
-
-
Naeemi, A.1
Meindl, J.D.2
-
30
-
-
33646248381
-
Compact physical models for multiwall carbon-nanotube interconnects
-
A. Naeemi and J. D. Meindl, "Compact physical models for multiwall carbon-nanotube interconnects," IEEE Electron Device Letters, vol. 27, pp. 338-340, 2006.
-
(2006)
IEEE Electron Device Letters
, vol.27
, pp. 338-340
-
-
Naeemi, A.1
Meindl, J.D.2
-
31
-
-
20144387793
-
How do carbon nanotubes fit into the semiconductor roadmap?
-
A. P. Graham, G. S. Duesberg, W. Hoenlein, F. Kreupl, M. Liebau, R. Martin, B. Rajasekharan, W. Pamler, R. Seidel, W. Steinhoegl, and E. Unger, "How do carbon nanotubes fit into the semiconductor roadmap?," Applied Physics. A, Materials Science & Processing, vol. 80, pp. 1141-1151, 2005.
-
(2005)
Applied Physics. A, Materials Science & Processing
, vol.80
, pp. 1141-1151
-
-
Graham, A.P.1
Duesberg, G.S.2
Hoenlein, W.3
Kreupl, F.4
Liebau, M.5
Martin, R.6
Rajasekharan, B.7
Pamler, W.8
Seidel, R.9
Steinhoegl, W.10
Unger, E.11
-
32
-
-
33846116009
-
Sorting carbon nanotubes by electronic structure using density differentiation
-
M. S. Arnold, A. A. Green, J. F. Hulvat, S. I. Stupp, and M. C. Hersam, "Sorting carbon nanotubes by electronic structure using density differentiation," Nature Nanotechnology, vol. 1, pp. 60-65, 2006.
-
(2006)
Nature Nanotechnology
, vol.1
, pp. 60-65
-
-
Arnold, M.S.1
Green, A.A.2
Hulvat, J.F.3
Stupp, S.I.4
Hersam, M.C.5
-
33
-
-
28244437189
-
Impact of size effects on the resistivity of copper wires and consequently the design and performance of metal interconnect networks
-
R. Sarvari, A. Naeemi, R. Venkatesan, and J. D. Meindl, "Impact of size effects on the resistivity of copper wires and consequently the design and performance of metal interconnect networks," Proceedings of the IEEE International Interconnect Technology Conference, pp. 197-199, 2005.
-
(2005)
Proceedings of the IEEE International Interconnect Technology Conference
, pp. 197-199
-
-
Sarvari, R.1
Naeemi, A.2
Venkatesan, R.3
Meindl, J.D.4
|