How do carbon nanotubes fit into the semiconductor roadmap?

Applied Physics A: Materials Science and Processing

Volumn 80, Issue 6, 2005, Pages 1141-1151

  Graham, A P ^a   Duesberg, G S ^a   Hoenlein, W ^a   Kreupl, F ^a   Liebau, M ^a   Martin, R ^a   Rajasekharan, B ^a   Pamler, W ^a   Seidel, R ^a   Steinhoegl, W ^a   Unger, E ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL STRUCTURE; CRYSTALLINE MATERIALS; DIELECTRIC MATERIALS; ETCHING; FERMI LEVEL; INTEGRATED CIRCUITS; MICROELECTRONICS; MICROPROCESSOR CHIPS; SEMICONDUCTOR MATERIALS; TRANSMISSION ELECTRON MICROSCOPY;

CRYSTALLINE STRUCTURE; INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS (ITRS); MULTI-WALLED CARBON NANOTUBES (MWCNT); NANOTUBE-BASED DEVICES;

CARBON NANOTUBES;

EID: 20144387793     PISSN: 09478396     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00339-004-3151-7     Document Type: Article

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