Gold superfill in sub-micrometer trenches

Electrochemical and Solid-State Letters

Volumn 8, Issue 3, 2005, Pages

  Josell, D ^a   Beauchamp, C R ^a   Kelley, D R ^a   Witt, C A ^b   Moffat, T P ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b Cookson Electronics ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; CHEMICAL VAPOR DEPOSITION; ELECTROLYTES; ELECTRON BEAMS; EVAPORATION; GALLIUM NITRIDE; GOLD; INTERCONNECTION NETWORKS; MATHEMATICAL MODELS; METALLIZING; SEMICONDUCTING GALLIUM ARSENIDE;

AG SUPERFILL; CURVATURE ENHANCED ACCELERATOR COVERAGE (CEAC) MECHANISM; DEPOSITION RATES; ELECTRON BEAM EVAPORATION;

ELECTRODEPOSITION;

EID: 15744391659     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1854777     Document Type: Article

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