Enhancement of iodine adsorption using I2 plasma for seedless catalyst-enhanced CVD of copper

Electrochemical and Solid-State Letters

Volumn 6, Issue 8, 2003, Pages

  Kwon, Oh Kyum ^a   Kim, Jae Hoon ^a   Park, Hyoung Sang ^b   Kang, Sang Won ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Genitech Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; CATALYSTS; CHEMICAL VAPOR DEPOSITION; COPPER; DIFFUSION; PLASMAS; VAPORS;

IODINE ADSORPTION;

IODINE;

EID: 0042266812     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1589631     Document Type: Article

References (9)

1. S. P. Murarka, Maier. Sci. Eng., R., 19, 87 (1997).
2. A. Jain, K. M. Chi, T. T. Kodas, and M. J. Hampden-Smith, J. Electrochem. Soc., 140, 1434 (1993).
3. F. B. Kaufman, D. B. Thompson, R. E. Broadie, M. A. Jaso, W. L. Guthrie, D. J. Pearson, and M. B. Small, J. Electrochem. Soc., 138, 3460 (1991).
4. P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans, and H. Deligianni, IBM J. Res. Dev., 42, 567 (1998).
5. K. C. Shim, H. B. Lee, O. K. Kwon, H. S. Park, W. Koh, and S. W. Kang, J. Electrochem. Soc., 149, G109 (2002).
6. E. S. Hwang and J. Lee, Chem. Mater., 12, 2076 (2000).
7. O. K. Kwon, H. B. Lee, H. S. Park, and S. W. Kang, J. Vac. Sci. Technol. A 20, 408 (2002).
8. J.-L. Lin and' E. Bent, J. Phys. Chem., 96, 8529 (1992).
9. X.-L. Zhou, C. Yoon, and J. M. While, Surf. Sci., 206, 379 (1988).