Design parameters influencing reliability of CCGA assembly: A sensitivity analysis

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 1056-1063

  Tasooji, Amaneh ^a   Ghaffarian, Reza ^b   Rinaldi, Antonio ^a  

^a ARIZONA STATE UNIVERSITY   (United States)

^b CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

CCGA; Column grid array; Creep; Fatigue; Microelectronic package; Reliability; Solder; Thermal cycling

Indexed keywords

CREEP; FATIGUE OF MATERIALS; RELIABILITY THEORY; SENSITIVITY ANALYSIS; SOLDERING ALLOYS; THERMAL CYCLING;

COLUMN GRID ARRAY; MICROELECTRONIC PACKAGE;

ELECTRONICS PACKAGING;

EID: 33845580894     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645461     Document Type: Conference Paper

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