Thermal cycle reliability and failure mechanisms of CCGA and PBGA assemblies with and without corner staking

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 391-398

  Ghaffarian, Reza ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Ball grid array; BGA; CCGA; CGA; Column grid array; Inspection; PBGA; Solder joint; Stake; Thermal cycle

Indexed keywords

FAILURE MECHANISMS; PLASTIC BALL GRID ARRAY (PBGA); PLASTIC PACKAGES; THERMAL CYCLE RELIABILITY;

AEROSPACE ENGINEERING; ARRAYS; ASSEMBLY; FAILURE ANALYSIS; RELIABILITY; THERMAL CYCLING;

ELECTRONICS PACKAGING;

EID: 24644465197     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

1. Ghaffarian, R., "Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies," 2000 IEEE Aerospace Conference Proceedings, 2000, p327
2. Fjelstad, J., Ghaffarian, R., Kim, YG., Chip Scale Packaging for Modern Electronics (Electrochemical Publications, 2002)
3. Ghaffarian, R., "Chip Scale Package Assembly Reliability," Chapter 23rd in Area Array Interconnect Handbook (Kluwer Academic Publishers, edited by Karl Puttlitz, Paul Totta, 2002)
4. Ghaffarian, R., "BGA Assembly Reliability," Chapter 20, Area Array Packaging Handbook (McGraw-Hill Publisher, Ken Gilleo, Editor)
5. Ghaffarian, R., "Comparison of X-ray Inspection Systems for BGA/CCGA Quality Assurance and Crack Detection," IPC APEX Proceedings, 2002
6. IPC 9701, "Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments," Published by IPC, Association Connecting Electronics Industries
7. Ghaffarian R., Kim, N., "How Underfill and Double-Sided Affect CSP Assembly Reliability," http://www.reed-electronics.com/semiconductor/ article/CA73744?pubdate=7%2F1%2F2000
8. Ghaffarian R., "Qualification Approaches and Thermal Cycle Test Results for CSP/BGA/FCBGA," Microelectronic Reliability, Volume 43, Issue 5, May 2003, 695-706
9. Mawer, A. and Luquette, L. (1997), "Interconnect Reliability of Ball Grid Array and Direct Chip Attach", IRPS 1997 Tutorial.
10. Master, Raj N., Dobear, Thomas P., Cole Marie S., Martin, Gregory B., "Ceramic Ball Grid Array for AMD K6 Microprocessors Applications," Proc Components and Technology Conference, Seattle, Washington, 1998
11. Master, Raj. N. Ong, O.T., "Ceramic Grid Array Technologies for ACPI Applications," Proc Surface Mount Technology Conference, 2000
12. Teng, Sue Y., Brillhart, Mark," Reliability Assessment of a Hight CTE CBGA for High Availability Systems," Proc Components and Technology Conference, 2002
13. Farooq, M., Goldmann, L., Martin, G., Goldsmith, C., Bergerson, C., "Thermo-Mechanical Fatigue Reliability of Pb-Free Ceramic Ball Grid Arrays: Experimental Data and Lifetime Prediction Modeling" Proc Components and Technology Conference, 2003
14. Interrante, M., et al, "Lead-Free Package Interconnection for Ceramic Grid Arrays," IEEE/CPMT/SEMI Int's Electronics Manufacturing Technology Symposium, 2003