SCOPUS 정보 검색 플랫폼

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1487-1495

CBGA to FR4 printed circuit board with no underfill thermal mismatch study

a Thin Film Technology Corporation (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; FAILURE ANALYSIS; MICROELECTRONICS; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; STRESS ANALYSIS; THERMAL CYCLING; THERMAL EXPANSION;

CERAMIC BALL GRID ARRAY; THERMAL MISMATCH;

ELECTRONICS PACKAGING;

EID: 0034822477 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (1)

References (11)

1
- 0003481313
- McGraw-Hill (New York)
- (2000) Electronic Packaging and Interconnection Handbook
- Harper, C.A.¹

2
- 0003608979
- An overview of ceramic ball and column grid array packaging
- J.H. Lau, ed., McGraw-Hill, Inc. (New York)
- (1995) Ball Grid Array Technology , pp. 115-129
- Caulfield, T.¹ Cole, M.² Cappo, F.³ Zitz, J.⁴ Benenati, J.⁵ Lau⁶

3
- 0003680898
- McGraw-Hill, Inc. (New York)
- (1995) Ball Grid Array Technology , pp. 237-245
- Lau, J.H.¹

4
- 0003617532
- Ball grid array flip chip technologies - Design for reliability
- Technical Seminar, 45th Electronic Components and Technology Conf, Las Vegas, Nevada, May. 21-24, 1995 , pp. 31
- Homa, T.R.¹ Gedney, R.W.²

5
- 0001481987
- Geometric optimization of controlled collapse interconnections
- (1969) IBM Journal of R&D , vol.13 , Issue.3 , pp. 251-265
- Goldman, L.S.¹

6
- 0003476810
- John Wiley & Sons (New York); Section 6.1.4
- (1991) Handbook of Surface Mount Technology
- Hinch, S.W.¹

7
- 0003537825
- Inelastic strain analysis of solder joint in NASA fatigue specimen
- Final Report, Grant No. NAG 5-1331, NASA Goddard Space Flight Center, Maryland, January 28
- (1991) , pp. 1-14
- Dasgupta, A.¹ Oyan, C.²

8
- 0003683733
- McGraw-Hill, Inc. (New York)
- (1985) Solder Joint Fatigue in Surface Mount Technology: State of the Art , pp. 91-104
- Lau, J.H.¹

9
- 0034479828
- Effect of simulation methodology on solder joint crack growth correlation
- Proc 50th Electronic Components and Technology Conf, Las Vegas, Nevada, May. 21-24, 2000 , pp. 1048-1058
- Darveaux, R.¹

10
- 0034476176
- Finite element modeling of BGA packages for life prediction
- Proc 50th Electronic Components and Technology Conf, Las Vegas, Nevada, May. 21-24, 2000 , pp. 1059-1063
- Gustafsson, G.¹

11
- 0004093302
- McGraw-Hill, Inc. (New York)
- (1997) Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies , pp. 153-218
- Lau, J.H.¹ Pao, Y.-H.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.