Accelerated thermal cycling and failure mechanisms for BGA and CSP assemblies

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 4, 2000, Pages 335-340

  Ghaffarian, Reza ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039896246     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.1289627     Document Type: Article

References (5)

1. Ghaffarian, R., 1988, “Ball Grid Array Packaging Guidelines,” distributed by Interconnection Technology Research Institute (ITRI), Aug. http://www.ITRI.org.
2. Ghaffarian, R., 2000, “Chip Scale Packaging Guidelines,” distributed by Interconnection Technology Research Institute (ITRI), http://www.ITRI.org
3. Ghaffarian, R., et al., 1988, “CSP Consortia Activities: Program Objectives and Status,” Surface Mount International Proceedings, Aug. 23-27, pp. 203-230.
4. Kapur, K. C., and Lamberson, L. R., 1977, Reliability in Engineering Desing, Wiley, New York, NY.
5. Martin, G., et al., 1997, “The Effect of Substrate Thickness on CBGA Fatigue Life,” Proceedings of Surface Mount International, Sept. 7-11, pp. 172-177.