Reliability of lead-free copper columns in comparison with tin-lead solder column interconnects

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 82-89

  Park, S B ^a   Joshi, Rahul ^a   Goldmann, Lewis ^b  

^a State University of New York at Binghamton   (United States)

^b IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; INTERFEROMETRY; MICROELECTRONICS; OPTICAL INTERCONNECTS; PLASTIC DEFORMATION; SOLDERING ALLOYS; THERMAL CYCLING; THERMOMECHANICAL TREATMENT; TIN ALLOYS;

ISOTHERMAL LOAD; SOLDER FILLET; TIN-LEAD COLUMNS;

ELECTRONICS PACKAGING;

EID: 10444251749     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Interrante, M. et al, "Lead-Free Package Inter-connections for Ceramic Grid Arrays", Proc SEMICON/West 2003, International Electronics Manufacturing Technology Symposium, Santa Clara, CA, July 2003.
2. Han, B., "Deformation Mechanism of Two-Phase Solder Column Interconnections Under Highly Accelerated Thermal Cycling Condition: An Experimental Study", J. of Electronic Packaging, Vol. 119, (1997), pp. 189-196.
3. Portable engineering moiré interferometer (PEMI™), refer the webpage: www.photomechanics.com
4. Post, D. et al, High Sensitivity Moire, Springer-Verlag (New York, 1994), pp. 65-67, 135-136.
5. "C4 CBGA and CCGA reliability data", IBM unclassified, June 2000.