Ceramic ball grid array for AMD K6 microprocessor application

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 702-706

  Master, R N ^a   Dolbear, T P ^a   Cole, M S ^b   Martin, G B ^b  

^a ADVANCED MICRO DEVICES   (United States)

^b IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; ELECTRONICS PACKAGING; NETWORK COMPONENTS; PERSONAL COMPUTERS; RELIABILITY; SEMICONDUCTOR DEVICE TESTING; SOLDERED JOINTS; MICROPROCESSOR CHIPS; SILICON WAFERS; SOLDERING ALLOYS;

ASSEMBLY PARAMETERS; BODY SIZES; CERAMIC BALL GRID ARRAYS; COMPRESSIVE LOADS; MICROPROCESSOR APPLICATIONS; SECOND LEVEL; SILICON DIE;

BALL GRID ARRAYS; ELECTRONICS PACKAGING;

CERAMIC BALL GRID ARRAYS (CBGA);

EID: 0031620193     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678775     Document Type: Conference Paper

References (2)

1. T. P. Dolbear, R. N. Master, M. S. Cole, G. B. Martin, "Effect of mechanical shock and vibration on the second-level temperature cycling reliability of ceramic ball grid arrays with a continuous compressive load applied" Proceedings of International Microelectronics and Packaging Society (IMAPS) 1997 Annual Conference, Philadelphia, PA, October, 1997.
2. G. B. Martin, M. S. Cole, P. J. Brofman, L. G. Goldmann, "The Effect of Substrate Thickness on CBGA Fatigue Life, " to be published at Surface Mount International (SMI), San Jose, CA, September 1997.