Underfilled bgas for ceramic bga packages and board-level reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1221-1226

  Burnette, T ^a   Johnson, Z ^a   Koschmieder, T ^a   Oyler, W ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; FINITE ELEMENT METHOD; RELIABILITY; STATISTICAL METHODS; TEMPERATURE; THERMAL EXPANSION;

CERAMIC BALL GRID ARRAY; COEFFICIENTS OF THERMAL EXPANSION; MOISTURE SENSITIVITY LEVEL;

ELECTRONICS PACKAGING;

EID: 0034482711     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)