Solder column interposer for single chip ceramic packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 426-429

  Master, Raj N ^a   Dolbear, Thomas ^a   Ong, O T ^a   Dubey, Ajit ^a   Yamasaki, K ^a   Saiki, H ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROPROCESSOR CHIPS; PERSONAL COMPUTERS; SOLDERING ALLOYS; SUBSTRATES;

CERAMIC BALL GRID ARRAY; SINGLE CHIP CERAMIC PACKAGING; SOLDER COLUMN INTERPOSER;

ELECTRONICS PACKAGING;

EID: 0032667373     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (2)