Reliability testing and data analysis of an 1657CCGA (ceramiC column grid array) package with lead-free solder paste on lead-free PCBs (printed circuit boards)

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 718-725

  Lau, John ^a   Dauksher, Walter ^a   Ott, Ed ^a   Shangguan, Dongkai ^b   Smetana, Joe ^c   Horsley, Rob ^d   Castello, Todd ^e   Love, Dave ^f   Menis, Irv ^g   Sullivan, Bob ^h  

^a AGILENT TECHNOLOGIES   (United States)

^b FLEXTRONICS INTERNATIONAL   (United States)

^c NOKIA RESEARCH CENTER   (United States)

^d Celestica   (United Kingdom)

^e Flextronics   (United States)

^f SUN MICROSYSTEMS   (United States)

^g IBM   (United States)

^h HDPUG   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ON-CHIP FREQUENCY; RELIABILITY TESTING; SOLDER COLUMNS; SOLDER PASTES;

DATA REDUCTION; ENVIRONMENTAL CHAMBERS; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; THERMAL CYCLING; WEIBULL DISTRIBUTION;

ELECTRONICS PACKAGING;

EID: 10444248752     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (24)

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