Thermo-mechanical fatigue reliability of Pb-free ceramic ball grid arrays: Experimental data and lifetime prediction modeling

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 827-833

  Farooq, Mukta ^a   Goldmann, Lewis ^a   Martin, Gregory ^a   Goldsmith, Charles ^a   Bergeron, Christian ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; CURRENT DENSITY; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; LAWS AND LEGISLATION; LEAD; OPTICAL INTERCONNECTS; OPTIMIZATION; RELIABILITY; SHRINKAGE; THERMAL EFFECTS; TIN ALLOYS;

ACCELERATED THERMAL CYCLING; CHIP CARRIER BODY SIZE; INPUT OUTPUT PITCH; LEAD FREE CERAMIC BALL GRID ARRAYS; LIFETIME PREDICTION MODELLING; THERMAL MISTMATCH STRAINS; THERMOMECHANICAL FATIGUE RELIABILITY; WIRING DENSITY;

ELECTRONICS PACKAGING;

EID: 0038012568     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. K.C. Norris and A.H. Landzberg, "Reliability of Controlled Collapse Interconnections," IBM Journal of Research and Development, Vol. 13, No. 3, May 1969, pp. 266-271
2. C.M. Miller, I.E. Anderson and J.F. Smith, "A Viable Sn-Pb Solder Substitute: Sn-Ag-Cu", J. Electronic Materials, 23(7) pp.595-601, 1994.
3. B. Huang and N-C. Lee, "Lead Free Alternatives: An Analysis of Performance Characteristics", Lead-Free Soldering Symposium, SUNY, Binghamton, NY, December 1999.
4. K. Levis and A. Mawer, "Assembly and Solder Joint Reliability of PBGA with Pb-free Interconnect", Proceedings of 50th Elec. Comp. & Tech. Conf., IEEE, May 2000.
5. S.K. Kang, J. Horkans, P.C. Andricacos, R.A. Carruthers, J. Cotte, M. Datta, P. Gruber, J.M.E. Harper, K. Kwietniak, C. Sambucetti, L. Shi, G. Brouillette, and D. Danovitch, "Pb-free Solder Alloys for Flip Chip Applications", Proceedings of 49th Elec. Comp. & Tech. Conf., IEEE, June 1999.
6. J. Bath et al., "Research Update: Lead Free Solder Alternatives," Circuits Assembly, vol.11, No.5, pp 31-40, May 2000.
7. M. Farooq, S. Ray, A. Sarkhel and C. Goldsmith, Proceedings of the 51st Electronic Components and Technology Conference, IEEE, May 2001.
8. M. Farooq, C. Goldsmith, R. Jackson, and G. Martin, "Lead-free CBGA: Thermo-Mechanical Fatigue Reliability: To be published in the Proceedings of the Annual TMS Conference Meeting, San Diego, March 2003.
9. S. Farooq, M. Interrante, S. Ray, and W. Sablinski, "Interconnection Structure and Module Assembly and Rework", U.S. Patent# 6235996 issued May 25, 2001.
10. P. Hart et al., "Characteristics of some lead-free solder pastes for microelectronics package assembly", Proceedings of the Semiconductor Packaging Symposium, SEMICON West, July 2000
11. G. Martin, M. Cole, P. Brofman, and L. Goldmann, "Substrate Thickness and CBGA Fatigue Life", SMT Magazine, Vol. 12, No. 2, pp 102-108, February 1998.
12. K.S. Kim, S.H. Huh, and K. Suganuma,: Materials Science and Engineering A, to be published.
13. D.W. Henderson, T. Gosselin, A. Sarkhel, S.K. Kang, W.K. Choi, D.Y. Shih, C. Goldsmith, K.J. Puttlitz, "Ag3Sn Plate Formation in the Solidification of Near-Ternary Eutectic Sn-Ag-Cu Alloys", J. of Materials Research, November 2002.