Lead-Free Package Interconnections for Ceramic Grid Arrays

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2003, Pages 85-92

  Interrante, Mario ^a   Coffin, Jeffrey ^a   Cole, Marie ^a   De Sousa, Isabel ^a   Farooq, Mukta ^a   Goldmann, Lewis ^a   Goldsmith, Charles ^a   Jozwiak, Janet ^a   Lopez, Tasha ^a   Martin, Gregory ^a   Truong, Van Thanh ^a   Welsh, David ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; LARGE SCALE SYSTEMS; MULTILAYERS; PRINTED CIRCUIT BOARDS; RELIABILITY; ASSEMBLY; COPPER; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTRIC POWER TRANSMISSION NETWORKS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; INDUSTRIAL ELECTRONICS; LEAD; LEAD-FREE SOLDERS; MANUFACTURE; PRINTED CIRCUITS; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; THERMAL EXPANSION; THERMAL FATIGUE; TIN;

CERAMIC-GRID ARRAYS;

ELECTRONICS PACKAGING; PRINTED CIRCUIT BOARDS;

ACCELERATED THERMAL CYCLING; CERAMIC COLUMN GRID ARRAY; CERAMICS; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; INTEGRATED CIRCUIT INTERCONNECTIONS; MANUFACTURING TECHNIQUES; MULTILAYER CERAMIC PACKAGE; PRINTED CIRCUIT BOARDS (PCB);

EID: 0141788719     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. rd Electronic Components and Technology Conference, IEEE, New Orleans, LA, May 2003.
2. rd Electronic Components and Technology Conference, 1995, IEEE, Piscataway, NJ, pp. 925-929.
3. rd Electronic Components and Technology Conference, 1997, IEEE, Piscataway, NJ, pp. 319-324.
4. Ray, S. et al, "CLASP Ceramic Column Grid Array Technology for Flip Chip Carriers," Proceedings of Semicon West, 7/99, San Jose.
5. Interrante, M.J. et. al., "High Density Column Grid Array Connections and Method Thereof," US Patent No. 6,429,388, 2002.
6. rd Electronic Components and Technology Conference, IEEE, New Orleans, LA, May 2003.
7. J-STD-020B, "Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices," IPC/JEDEC, July 2002.
8. IPC 9701: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments, Aug 2001, Northbrook, IL, IPC.