Pb-free solder challenges in electronic packaging and assembly

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 58-63

  Hua, Fay ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; ELECTRON DEVICE MANUFACTURE; FLIP CHIP DEVICES; MICROPROCESSOR CHIPS; MICROSTRUCTURE; SOLDERING; SURFACE MOUNT TECHNOLOGY;

BALL GRID ARRAYS; LEAD-FREE SOLDER;

ELECTRONICS PACKAGING;

EID: 0037675719     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)

1. F. Hua, "Lead-free solders for electronic assembly", Design and reliability of solder and Solder Interconnections. Edited by R.K. Mahidhara, D.R. Fear, S.M.L. Sastry, K.L. Murty, P.K. Liaw and W. Winterbottom, pp. 65-73.
2. J. Glazer, International Materials review, vol. 40, No.2, 1995, pp. 65-93
3. NCMS Pb-free solder report
4. Prismark LLC Electronics Industry Report 2002.
5. H.G. Song, J.W. Morris, Jr. and F. Hua, "Anomalous Creep in Sn-Rich Solder Joints",Trans. JIM, 48 (2002) 1847
6. H.G. Song, J.W. Morris, Jr. and F. Hua, "Creep Properties of Pb-Free Solder Joints", J. Metals, 54 (2002) 30
7. J. G. Lee, A. Telang, K. N. Subramanian, and T. R. Bieler, "Modeling Thermalmechanical Fatigue Behavior of Sn-Ag Solder Joints", Journal of Electronic Materials, Vol. 31, No. 11, 2002.
8. N. Chawla, F. Hua unpublished communication 2002.
9. I. Datta, A. Gopinath and C. Marshall, "Underfill Constrain Effects during Thermal-Mechanical Cycling of Flip Chip Solder Joints", J. Electronic Material, 31, pp 253-264, 2002.
10. Alan Woosley, Geoff Swan, T.S. Chong, Linda Matsushita, Thomas Koschmieder and Kennon Simmons, "Development of Lead (Pb) and Halogen Free Peripheral Leaded and PBGA Components to Meet MSL3 260C Peak Reflow", Work presented by the research team from Motorola at EGG, 2001
11. 2001 ITRS roadmap, Chi Shih Chang "Review of Electronics packaging Issues in ITRS 2001".
12. F. Hua, C. Mike Garner, H.G. Song, J.W. Morris, Jr., "Creep of Pb-free Solders", ASME conference proceeding 2001.
13. J. Lloyd, "Electromigration Study of Pure Sn Conductors", Pb-free Solder for Electronic, Optical, and MEMs Packaging Manufacturing workshop, 2002.
14. James C. Bartelo, "The effect of temperature range during thermal cycling on thermomechanical fatigue behavior of selected Pb-free solders", ECTC proceeding 2002.
15. F. Hua, R. Aspandiar, T. Rothman, C. Anderson, M. Klier, "Solder Joint Reliability of Sn-Ag-Cu BGA Components Attached with Eutectic Pb-Sn Solder Paste", SMTA conference proceeding, 2002.
16. Guanghai Xu, Jun He, Eb Andideh, Jeff Bielefeld, and Tracey Scherban, "Cohesive Strength Characterization of Brittle Low K Film", International Interconnect Technology Conference Proceeding, San Francisco, pp.57-59, 2002.
17. Peter Elenius, Flip Chip Technology, ECTC proceeding 1999.
18. K. N. Tu, Xu Gu, Hua Gan, and W.J. Choi, "Electromigration in Solder Joints and lines", Pb-free Solder for Electronic", Optical, and MEMs Packaging Manufacturing workshop, 2002.
19. Se-yeong Jang, Juregen Wold, woon-Seong Kwon, Kyung-Wook Paik, "UBM Study for Pb-free electroplating Bumping: Interface Reaction and Electromigration", ECTC conference proceeding, 2002.
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