Nanoindentation study of the sputtered Cu thin films for interconnect applications

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 343-347

  Srinivasarao, V ^a,b   Jayaganthan, R ^a   Sekhar, V N ^a   Mohankumar, K ^a   Tay, A A O ^a   Kripesh, V ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; HARDNESS; INDENTATION; MAGNETRON SPUTTERING; SILICON WAFERS; THIN FILMS;

CU THIN FILMS; NANOINDENTATION;

COPPER;

EID: 28444435224     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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