SCOPUS 정보 검색 플랫폼

Materials Research Society Symposium Proceedings

Volumn 812, Issue , 2004, Pages 171-177

Effect of annealing on the structural, mechanical and tribological properties of electroplated Cu thin films

(5) Shukla, P a Sikder, A K a Zantye, P B a Kumar, Ashok a Sanganaria, M a

a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; ELASTIC MODULI; ELECTROPLATING; FINITE ELEMENT METHOD; HARDNESS; INDENTATION; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; METALLIZING; SINGLE CRYSTALS; TRANSMISSION ELECTRON MICROSCOPY; TRIBOLOGY; X RAY DIFFRACTION ANALYSIS;

DIFFRACTION PATTERNS; FINITE ELEMENT MODELING; GRAZING INCIDENCE X-RAY DIFFRACTION (GIXRD); INTERLAYER DIELECTRICS (ILD);

THIN FILMS;

EID: 12844266764 PISSN: 02729172 EISSN: None Source Type: Conference Proceeding
DOI: 10.1557/proc-812-f3.16 Document Type: Conference Paper

Times cited : (4)

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