Mechanical properties and stresses in thin gold films on a silicon substrate

Materials Research Society Symposium - Proceedings

Volumn 695, Issue , 2002, Pages 197-202

  Xie, Changjin ^a   Emery, Richard D ^a   Yang, Seung Yong ^a   Tong, Wei ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; EVAPORATION; INDENTATION; MICROSCOPIC EXAMINATION; MICROSTRUCTURE; PLASTICITY; SILICON; STRESSES; TENSILE TESTING; THICKNESS MEASUREMENT; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

CRYSTAL PLASTICITY MODEL; ELECTRON BEAM EVAPORATION; NANOINDENTATION TESTS; ORIENTATION IMAGING MICROSCOPY; SCANNING ION MICROSCOPY; SILICON SUBSTRATE; STRESS-STRAIN BEHAVIOR;

GOLD;

EID: 0036352178     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

1. Fundamentals of nanoindentation and nanotribology
2. On the mechanical behavior of free-standing thin gold films
3. Spatial characterization and modeling of unstable plastic flows in two aluminum alloys