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Volumn 6151 I, Issue , 2006, Pages

EUV mask and chuck analysis - Simulation and experimentation

Author keywords

Electrostatic chucking experiments; EUV lithography; Finite element analysis; Flatness specifications

Indexed keywords

ELECTROSTATIC CHUCKING EXPERIMENTS; EUV LITHOGRAPHY; FLATNESS SPECIFICATIONS; SURFACE FLATNESS;

EID: 33745602194     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.657154     Document Type: Conference Paper
Times cited : (8)

References (23)
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  • 2
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    • Generation mechanism of residual clamping force in a bipolar electrostatic chuck
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    • Kannoa, S.1    Usui, T.2
  • 15
    • 21144477903 scopus 로고
    • Low voltage and high speed operating electrostatic wafer chuck
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    • (1992) Journal of Vacuum Science and Technology A , vol.10 , Issue.6 , pp. 3573-3578
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  • 16
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    • Effect of electrostatic chucking and substrate thickness uniformity on EUVL mask flatness
    • A. R. Mikkelson, R. L. Engelstad, J. Sohn, and E. G. Lovell, "Effect of Electrostatic Chucking and Substrate Thickness Uniformity on EUVL Mask Flatness," Journal of Vacuum Science and Technology B, Vol. 22, No. 6, pp. 3043-3048, 2004.
    • (2004) Journal of Vacuum Science and Technology B , vol.22 , Issue.6 , pp. 3043-3048
    • Mikkelson, A.R.1    Engelstad, R.L.2    Sohn, J.3    Lovell, E.G.4
  • 18
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    • (2003)
    • Claudet, A.1
  • 21
    • 0036643867 scopus 로고    scopus 로고
    • Electrostatic chuck behaviour at ambient conditions
    • G. Kalkowski, S. Risse, and V. Guyenot, "Electrostatic Chuck Behaviour at Ambient Conditions," Microelectronic Engineering, Vol. 61-62, pp. 357-361, 2002.
    • (2002) Microelectronic Engineering , vol.61-62 , pp. 357-361
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  • 22
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    • Low-thermal expansion electrostatic chuck materials and clamp mechanisms in vacuum and air
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    • (2004) Microelectronic Engineering , vol.73-74 , pp. 941-947
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  • 23
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    • Characterization of electrostatically chucked EUVL mask blanks
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.