Characterization of electrostatically chucked EUVL mask blanks

Progress in Biomedical Optics and Imaging - Proceedings of SPIE

Volumn 5751, Issue II, 2005, Pages 640-650

  Ligman, Rebekah K ^a,b   Shu, Emily Y ^a   Yan, Pei Yang ^a  

^a INTEL CORPORATION   (United States)

^b UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHUCK STIFFNESS; CHUCK SURFACE; CHUCKED RETICLES; ELECTROSTATIC CHUCKS;

DIELECTRIC MATERIALS; ELECTROSTATICS; FINISHING; HYSTERESIS; STIFFNESS; ULTRAVIOLET RADIATION;

CHUCKS;

EID: 24644479610     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.601043     Document Type: Conference Paper

References (4)

1. SEMI P37 -l 102 specification on Extreme Ultraviolet Lithography mask substrates.
2. SEMI P40 -1103 specification for Mounting Requirements and Alignment Reference Locations for Extreme Ultraviolet Lithography Masks.
3. A. Mikkelson, R. Engelstad, E. Lovell, K. Blaedel, A. Claudet, "Extreme ultraviolet lithography mask flatness and electrostatic chucking analysis, Journal of Vacuum Science and Technology B, Vol 21, Iss. 6, pg 3091 - 3096, Nov/Dec 2003.
4. R. Tejeda, R. Engelstad, E. Lovell, K. Blaedel, "Particle-induced distortion in extreme ultraviolet lithography reticles during exposure chucking", Journal of Vacuum Science and Technology B, Vol. 20, Iss. 6, pg 2840 - 2843, Nov/Dec 2002.