Low-thermal expansion electrostatic chuck materials and clamp mechanisms in vacuum and air

Microelectronic Engineering

Volumn 73-74, Issue , 2004, Pages 941-947

  Van Elp, J ^a   Giesen, P T M ^a   De Groof, A M M ^a  

^a TNO   (Netherlands)

Author keywords

Electrical breakdown mechanism; Electrostatic chucks; Extreme ultraviolet lithography; Ultralow expansion materials

Indexed keywords

ATMOSPHERIC PRESSURE; CHUCKS; ELECTRIC BREAKDOWN; ELECTRODES; LITHOGRAPHY; THERMAL EXPANSION; ULTRAVIOLET RADIATION; VACUUM;

ELECTROSTATIC CHUCKS; EXTREME ULTRAVIOLET LITHOGRAPHY; ULTRALOW EXPANSION MATERIALS;

ELECTROSTATICS;

EID: 2542481250     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(04)00248-5     Document Type: Conference Paper

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