Effect of electrostatic chucking on EUVL mask flatness

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5504, Issue , 2004, Pages 120-128

  Mikkelson, Andrew ^a   Engelstad, Roxann ^a   Lovell, Edward ^a   Aschke, Lutz ^b   Rüggeberg, Frauke ^b   Sobel, Frank ^b  

^a Computational Mechanics Center ^*  (United States)

^b Schott Lithotec AG   (Germany)

Author keywords

Electrostatic chucking; EUV lithography; Finite element analysis; Mask flatness

Indexed keywords

CLAMPING DEVICES; ELECTROSTATICS; FABRICATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PARAMETER ESTIMATION; POLISHING; STIFFNESS;

ELECTROSTATIC CHUCKING; FINISHING TECHNIQUES; FLATNESS QUALITY AREA; MASK FLATNESS;

MASKS;

EID: 3843063396     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.568014     Document Type: Conference Paper

References (7)

1. International Technology Roadmap for Semiconductors, Semiconductor Industry Association, December, 2001.
2. Blaedel, K., Taylor, J., Hector, S., Yan, P., Ramamoorthy, A., and Brooker, P., Proc. SPIE 4688, 767, 2002.
3. Sobel, F., Aschke, L., Becker, H., Renno, M., Rüggeberg, F., Kirchner, S., Luetbecher, T., Olschewski, N., Schiffler, M., Walter, K., Heß, G., Buttgereit, U., Knapp, K., Lebert, R., Juschkin, L., Wies, C., and Jägle, B., SPIE 5256, 2003.
4. H. Meiling, et al., J. Vac. Sci. Technol. B 18, 2921 (2000).
5. Wolfram Research website at http://mathworld.wolfram.com/ LegendrePolynomial.html.
6. Mikkelson, A., Engelstad, R., Lovell, E., Blaedel, K., and Claudet, A., J. Vac. Sci. Technol. B, Nov/Dec, 2003.
7. SEMI P37-1101, SEMI Standard Specification for Extreme Ultraviolet Lithography Mask Substrates.