Residual stress analysis in micro- and nano-structured materials by X-ray diffraction

International Journal of Materials and Product Technology

Volumn 26, Issue 3-4, 2006, Pages 354-371

  Gergaud, P ^a   Goudeau, P ^a,b,e   Sicardy, O ^c,f   Tamura, N ^d   Thomas, O ^a,g  

^a CNRS   (France)

^b UNIVERSITÉ DE POITIERS   (France)

^c CEA GRENOBLE   (France)

^d LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^e Laboratory of Physical Metallurgy   (France)

^f Direction of Technological Research (CEA DRT)   (France)

^g AIX MARSEILLE UNIVERSITY   (France)

Author keywords

Micro and nano structured materials; Residual stresses; Synchrotron radiation; X ray diffraction

Indexed keywords

DATA REDUCTION; NANOSTRUCTURED MATERIALS; STRESS ANALYSIS; SYNCHROTRON RADIATION; X RAY DIFFRACTION ANALYSIS;

ELECTRONIC DEVICES; MICRO- AND NANO-STRUCTURED MATERIALS; RESIDUAL STRESS ANALYSIS;

RESIDUAL STRESSES;

EID: 33646237587     PISSN: 02681900     EISSN: None     Source Type: Journal    
DOI: 10.1504/ijmpt.2006.009475     Document Type: Article

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