Surface characterization of copper electroless deposition on atomic layer deposited palladium on iridium and tungsten

Surface and Coatings Technology

Volumn 200, Issue 20-21, 2006, Pages 5760-5766

  Kim, Young Soon ^a   Shin, Jiho ^b   Cho, Joong Hee ^a   Ten Eyck, Gregory A ^c   Liu, De Li ^c   Pimanpang, Samuk ^c   Lu, Toh Ming ^c   Senkevich, Jay J ^d   Shin, Hyung Shik ^a  

^a Chonbuk National University   (South Korea)

^b Korea Minjok Leadership Academy   (South Korea)

^c RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^d BREWER SCIENCE INC   (United States)

Author keywords

Copper; Electroless deposition; Iridium; Tungsten; XPS

Indexed keywords

CATALYSTS; ELECTRIC CONDUCTIVITY; HARDNESS; IRIDIUM; MELTING; PALLADIUM; SUBLIMATION; SUBSTRATES; SURFACE PROPERTIES; TUNGSTEN; X RAY PHOTOELECTRON SPECTROSCOPY;

ETHYLENEDIAMINE-TETRAACETIC ACID (EDTA); GLYOXYLIC ACID;

ELECTROLESS PLATING;

CATALYSTS; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; HARDNESS; IRIDIUM; MELTING; PALLADIUM; SUBLIMATION; SUBSTRATES; SURFACE PROPERTIES; TUNGSTEN; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 33645831386     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.08.142     Document Type: Article

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