Atomic layer deposition of Pd on TaN for Cu electroless plating

Journal of the Electrochemical Society

Volumn 152, Issue 6, 2005, Pages

  Kim, Young Soon ^a   Ten Eyck, Gregory A ^a   Ye, Dexian ^a   Jezewski, Christopher ^a   Karabacak, Tansel ^a   Shin, Hyung Shik ^b   Senkevich, Jay J ^a   Lu, Toh Ming ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b Chonbuk National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSTS; CHEMICAL VAPOR DEPOSITION; ELECTRODEPOSITION; ELECTROLESS PLATING; MOLECULAR VIBRATIONS; PASSIVATION; POLYETHYLENES; SURFACE ROUGHNESS; ULTRASONICS;

ATOMIC LAYER DEPOSITION (ALD); ELECTROLESS DEPOSITION (ELD); PALLADIUM CATALYSTS; ULTRASONIC VIBRATIONS;

PALLADIUM COMPOUNDS;

EID: 22544470608     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1899285     Document Type: Article

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