Properties including step coverage of TiN thin films prepared by atomic layer deposition

Applied Surface Science

Volumn 210, Issue 3-4, 2003, Pages 231-239

  Kim, J ^a   Hong, H ^a   Oh, K ^b   Lee, C ^a  

^a Inha University   (South Korea)

^b Jusung Engineering Company Limited   (South Korea)

Author keywords

AES; ALD; Aspect ratio; Resistivity; Step coverage; TiN

Indexed keywords

ATOMIC FORCE MICROSCOPY; AUGER ELECTRON SPECTROSCOPY; CHEMICAL VAPOR DEPOSITION; DEPOSITION; PHYSICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; THIN FILMS; TITANIUM NITRIDE; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

ATOMIC LAYER DEPOSITION (ALD);

SURFACE PROPERTIES;

EID: 0037446482     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(03)00158-2     Document Type: Article

References (21)

1. L.E. Toth, Transition Metal Carbides and Nitrides, vol. 7, Academic Press, New York, 1971.
2. Wittmer M., Noser J., Melchior H. J. Appl. Phys. 52:1981;6659.
3. Sundgren J.-E. Thin Solid Films. 128:1985;21.
4. Sherman A. Jpn. J. Appl. Phys. 30:1991;3553.
5. Lim H.S., Kang S.B., Jeon I.S., Choi G.H., Park Y.W., Lee S.I., Moon J.T. Jpn. J. Appl. Phys. 40:2001;2669.
6. Cerio F., Drewery J., Huang E., Reynolds G. J. Vac. Sci. Technol. A. 16:1998;1863.
7. Hu J.C., Chang T.C., Chen L.J., Yang Y.L., Chang C.Y. Thin Solid Films. 332:1998;423.
8. Kim D.H., Kim J.J., Park J.W., Kim J.J. J. Electrochem. Soc. 143:1996;L188.
9. Tobe R., Sekiguchi A., Sasaki M., Okada O., Hosokawa N. Thin Solid Films. 281:1996;155.
10. Jeon H., Lee J.-W., Kim Y.-D., Kim D.-S., Yi K.-S. J. Vac. Sci. Technol. A. 18(4):2000;1595.
11. Ritala M., Asikainen T., Leskela M., Jokinen J., Lappalainen R., Utriainen M., Niinisto L., Ristolainen E. Appl. Surf. Sci. 120:1997;199.
12. Min J.-S., Son Y.-W., Kang W.-G., Chun S.-S., Kang S.-W. Jpn. J. Appl. Phys. 37:1998;4999.
13. Ritala M., Leskela M., Rauhala E., Jokinen J. J. Electrochem. Soc. 142:1995;2731.
14. Ahn C.H., Cho S.G., Lee H.J., Park K.H., Jeong S.H. Metals Mater. Int. 7:2001;621.
15. Kim D.-J., Jung Y.-B., Lee M.-B., Lee Y.-H., Lee J.-H., Lee J.-H. Thin Solid Films. 372:2000;276.
16. Schintlmeister W., Pacher O., Pfaffinger K. J. Electrochem. Soc. 123:1976;924.
17. Yun J.-Y., Rhee S.-W. Thin Solid Films. 320:1998;163.
18. Kashani H., Heydarzadeh Sohi M., Kaypour H. Mater. Sci. Eng. A. 286:2000;324.
19. Buiting M.J., Otterloo A.F. J. Electrochem. Soc. 139:1992;2580.
20. Willmott P.R., Timm R., Huber J.R. Appl. Surf. Sci. 127-129:1998;105.
21. Galvanetto E., Galliano F.P., Borgioli F., Bardi U., Lavacchi A. Thin Solid Films. 384:2001;223.