Properties and deposition processes of a-C: H films from CH4/Ar dielectric barrier discharge plasmas

Surface and Coatings Technology

Volumn 200, Issue 20-21, 2006, Pages 5819-5822

  Liu, Y H ^a   Li, J ^a   Liu, D P ^b   Ma, T C ^a   Benstetter, G ^b  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b DEGGENDORF INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

Diamond like carbon; Dielectric barrier discharge; Plasma deposition

Indexed keywords

ARGON; DEPOSITION; DIAMOND LIKE CARBON FILMS; HARDNESS; HYDROCARBONS; HYDROGENATION; KINETIC ENERGY; METHANE; PLASMAS; SPUTTERING; SURFACE ROUGHNESS;

DEPOSITION RATE; DIELECTRIC BARRIER DISCHARGE; FILM HARDNESS; PLASMA DEPOSITION;

AMORPHOUS FILMS;

AMORPHOUS FILMS; ARGON; DEPOSITION; DIAMOND LIKE CARBON FILMS; HARDNESS; HYDROCARBONS; HYDROGENATION; KINETIC ENERGY; METHANE; PLASMAS; SPUTTERING; SURFACE ROUGHNESS;

EID: 33645753060     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.08.123     Document Type: Article

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