Eliminating backgrind defects with wet chemical etching

Solid State Technology

Volumn 41, Issue 11, 1998, Pages 85-90

  McHatton, Cheryl ^a   Gumbert, Cynthia M ^b,c  

^a SEZ America Inc   (United States)

^b ADE Corporation   (United States)

^c CMP Metrology at ADE Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0012834296     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (5)

1. M.K. Grief, J.A. Steele Jr., "Warpage and Mechanical Strength Studies of Ultra Thin 150-mm Wafers," 1996 IEEE/CPMT Int'l Electronics Manufacturing Technology Symposium Proceedings, pp. 190-194.
2. R. Mendelson, D. Diefenderfer, C.M. Gumbert, B. Singh, "Optimized Backgrind Wafer Process Minimizes Stress Effects," Semiconductor International, pp. 221-226, October 1996.
3. "The Importance of Measuring Cumulative Film Stresses and Its Relationship to Wafer Backgrinding: Characterizing Process Interactions," ADE Corp. Application Note, No. D3010, 1993.
4. I. Blech, D. Dang, "Silicon Wafer Deformation After Backside Grinding," Solid State Technology, pp. 73-76, August 1994.
5. "Backgrind Processing Using ADE Tools for Control and Analysis," ADE Corp. Application Note, No. D2001, 1992.