Moore's law: The next dimension

Advanced Packaging

Volumn 7, Issue 7, 1998, Pages 55-58

  Savastiouk, Sergey ^a   Siniaguine, Oleg ^b   DiOrio, Mark ^b  

^a Tru Si Technologies   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002849693     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (6)

1. Savastiouk, Siniaguine, Hammond, Atmospheric Downstream Plasma - A New Tool for Semiconductor Processing, Solid State Technology, July 1998.
2. Savastiouk, Siniaguine, Hammond, Atmospheric Downstream Plasma, European Semiconductor, June 1998.
3. Weiss, Dean, DiOrio, Wafer Dicing. . .Step by Step, Advanced Packaging Magazine, January 1998.
4. DiOrio, Wafer Backgrinding- The Back-End of Fab or the Front-End of Assembly?, Advanced Packaging Magazine, February 1998.
5. Pinamaneni, DiOrio, Material Effects on the Performance and Reliability of High Power Molded Dual-inLine Packages, IEEE 38th Electronics Components Conference Proceedings, 1988.
6. Pinamaneni, DiOrio, Assembly Techniques Related to Die Crack in High Power Dissipation MDIPs, IEEE 38th Electronics Components Conference Proceedings, 1988.