Correlation of silicon wafer strength to the surface morphology

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE

Volumn , Issue , 2000, Pages 147-151

  Omar, Ghazali ^a,b   Tamaldin, Noreffendy ^a   Muhamad, Muhamad Rasat ^b   Hock, Tan Chong ^a  

^a ON Semiconductor SCG Industries M Sdn Bhd Malaysia   (Malaysia)

^b UNIVERSITY OF MALAYA   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

AFM; ATOMIC FORCE MICROSCOPE (AFM); DIE ASSEMBLY; DIE STRENGTH; ETCH PITS; FRONT-END PROCESS; METAL DEPOSITION; MICROELECTRONIC PACKAGING; SURFACE FINISHES; WAFER PROCESSING; WAFER STRENGTH; WET-ETCH;

ATOMIC FORCE MICROSCOPY; CHIP SCALE PACKAGES; DIES; MICROELECTRONICS; SURFACE MORPHOLOGY; WET ETCHING;

SILICON WAFERS;

EID: 33645234249     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. C. Christenson, " Grinding and Back Metallization: A Motorola Internal Benchmark, ERP Project Report 11, Mos IV 1994
2. M. Lisa, C. Brian, " Investigation of Si Strength", Motorola SPS, 1998
3. H. Irvin, L. John, N. Saha, M. Alan, " Strength of Ex-Situ Annealed Ni Di Backmetallized Dies", Technical Report, Motorola SPS, 1998
4. Betty Leung, Yifan Guo, S. Vijay, "Die Strength Evaluation in the Presence of Edge Cracks", Proceedings of 1998 AMT Symposium
5. R.W. Hertzberg, " Deformation and racture Mechanics of Engineering Materials" 4th Edition, John Wiley & Sons, Inc. 1995