메뉴 건너뛰기




Volumn 25, Issue 4, 2004, Pages 430-435

Design and simulation of on-line test structure for thermal conductivity of polysilicon thin films

Author keywords

Polysilicon thin films; Surface micromachining technique; Test structure; Thermal conductivity

Indexed keywords

FINITE ELEMENT METHOD; HEAT TRANSFER; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; ONLINE SYSTEMS; POLYSILICON; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY;

EID: 7244260531     PISSN: 02534177     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (4)

References (5)
  • 1
    • 0035440478 scopus 로고    scopus 로고
    • Thermal conductivity of doped polysilicon layers
    • McConnell D, Uma S. Thermal conductivity of doped polysilicon layers. Microelectromechanical Systems, 2001, 10(3): 360
    • (2001) Microelectromechanical Systems , vol.10 , Issue.3 , pp. 360
    • McConnell, D.1    Uma, S.2
  • 2
    • 0030091524 scopus 로고    scopus 로고
    • Thermal conductivity measurements on thin films based on micromechanical devices
    • Jansen E, Obermeier E. Thermal conductivity measurements on thin films based on micromechanical devices. J Micromech Microeng, 1996, 6(3): 118
    • (1996) J Micromech Microeng , vol.6 , Issue.3 , pp. 118
    • Jansen, E.1    Obermeier, E.2
  • 3
    • 0343193098 scopus 로고    scopus 로고
    • Process dependent thin film thermal conductivity for thermal CMOS MEMS
    • Arx M, Paul O, Baltes H. Process dependent thin film thermal conductivity for thermal CMOS MEMS. J Microelectromechanical Systems, 2000, 9(1): 136
    • (2000) J Microelectromechanical Systems , vol.9 , Issue.1 , pp. 136
    • Arx, M.1    Paul, O.2    Baltes, H.3
  • 4
    • 0036494515 scopus 로고    scopus 로고
    • Numerical simulation of a polysilicon thermal flexure actuator
    • Kuang Y, Huang Q A, Lee N K S. Numerical simulation of a polysilicon thermal flexure actuator. Microsystem Technology, 2002, 8: 17
    • (2002) Microsystem Technology , vol.8 , pp. 17
    • Kuang, Y.1    Huang, Q.A.2    Lee, K.S.3
  • 5
    • 0003714019 scopus 로고    scopus 로고
    • Beijing: Higher Education Press
    • Yang Shiming, Tao Wenquan. Heat transfer. Beijing: Higher Education Press, 1998
    • (1998) Heat Transfer
    • Yang, S.1    Tao, W.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.